Surface Acoustic Wave Resonator Layout for Substrate Miniaturization
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Solution Overview
Problem
The existing surface acoustic wave devices face limitations in miniaturization due to the need for a large surface area on piezoelectric substrates, which restricts the reduction of component size and design flexibility, as wiring patterns and functional elements must be arranged on a single surface.
Innovation Solution
The surface acoustic wave device incorporates a multilayer piezoelectric substrate with functional elements on one surface and wiring patterns on a different surface, utilizing through-electrodes to connect them, allowing for three-dimensional arrangement and reducing the surface area required for wiring, thereby enabling miniaturization and increased design freedom.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If wiring patterns and functional elements are arranged on a single surface of the piezoelectric substrate, then the device structure is simple, but the surface area required is large, limiting miniaturization
Solution Approach 1:
The patent applies dimensionality change by moving wiring patterns from the front surface to the back surface of the piezoelectric substrate. This spatial redistribution across multiple surfaces reduces the surface area occupation on the front surface, enabling miniaturization of the functional elements while maintaining all necessary electrical connections.
2Ease of manufacture
If all functional elements and wiring patterns are arranged on one surface, then manufacturing is simpler, but design flexibility and arrangement freedom are limited
Solution Approach 1:
By utilizing the back surface of the piezoelectric substrate for wiring patterns, the invention creates additional design space. This enables independent optimization of functional element arrangement on the front surface and wiring pattern layout on the back surface, significantly increasing design flexibility without complicating the manufacturing process.
3Ease of operation
If wiring patterns are placed on the front surface with functional elements, then connection is direct, but the occupied area increases, preventing size reduction
Solution Approach 1:
The patent segments the device into two functional layers: the front surface for functional elements and the back surface for wiring patterns. Through-electrodes provide vertical connections between these layers, replacing traditional planar connections. This segmentation enables direct three-dimensional connections while minimizing surface area occupation.
Solution Approach 2:
The invention transitions from two-dimensional planar connections to three-dimensional spatial connections by utilizing the vertical dimension through through-electrodes. This allows wiring to pass through the substrate thickness rather than extending across the surface, dramatically reducing the occupied surface area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the size of the surface acoustic wave device and enhances design flexibility by allowing wiring patterns to be placed on a separate surface, minimizing the occupied area and improving the device's compactness and performance.
Implementation Method 1
a surface acoustic wave resonator is defined by the piezoelectric substrate and the IDT electrode
Data Source
AI summary
A surface acoustic wave device includes a piezoelectric substrate and functional elements on a first surface of the piezoelectric substrate. At least a portion of the functional elements includes an interdigital transducer (IDT) electrode, and a surface acoustic wave resonator is defined by the piezoelectric substrate and the IDT electrode. A portion of a wiring pattern connecting a first functional element and a second functional element is on a second surface different from the first surface of the piezoelectric substrate.