SAW Sensor Cavity Structure for 1000°C Temperature-Pressure Sensing
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Solution Overview
Problem
Existing temperature and pressure sensors cannot operate effectively in rocket engine environments exceeding 1000°C due to high temperatures, limiting real-time health monitoring of components.
Innovation Solution
A surface-acoustic-wave temperature and pressure sensing device utilizing high-temperature-resistant substrates with integrated sensors, including a sealed cavity and multiple sensor configurations for temperature compensation, allowing operation up to high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If existing temperature sensors and pressure sensors are used, then the device complexity is low, but the maximum operating temperature is limited to 800°C which cannot meet rocket engine requirements exceeding 1000°C
Solution Approach 1:
The patent uses lanthanum gallium silicate substrate material which is a composite ceramic material capable of withstanding temperatures exceeding 1000°C. This composite material enables the sensor to operate in high-temperature rocket engine environments while maintaining structural integrity and measurement accuracy, directly resolving the temperature limitation of existing sensors.
Solution Approach 2:
The sensor is divided into functionally independent modules: temperature sensing elements, pressure sensing elements, and compensation elements, all integrated on the high-temperature substrate. This segmentation allows each module to be optimized for its specific function while the overall structure maintains simplicity, resolving the contradiction between high-temperature capability and device complexity.
2Measurement precision
If temperature compensation measures are implemented, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The patent combines temperature compensation functionality directly into the pressure sensing structure by integrating temperature sensing elements and compensation algorithms within the same device architecture. This merging approach improves pressure measurement precision by eliminating temperature interference while avoiding the need for separate compensation devices, thus not increasing overall device complexity.
Solution Approach 2:
The sensor incorporates feedback mechanisms where temperature measurements are continuously monitored and used to compensate pressure readings in real-time. This feedback loop enhances measurement precision by dynamically correcting for temperature effects, while the integrated design keeps the overall device complexity manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables real-time health monitoring of components in high-temperature environments by increasing sensor operating temperatures and maintaining measurement accuracy through temperature compensation, with a simple structure and low manufacturing cost.
Implementation Method 1
first surface-acoustic-wave temperature sensors and surface-acoustic-wave pressure sensors are formed on a first surface of the first high-temperature-resistant substrate located in the cavity
Data Source
AI summary
Disclosed in the present disclosure are a surface-acoustic-wave temperature and pressure sensing device and a manufacturing method thereof. The surface-acoustic-wave temperature and pressure sensing device includes a first high-temperature-resistant substrate and a second high-temperature-resistant substrate bonded together, where a recess is formed in the second high-temperature-resistant substrate to form a sealed cavity between the first high-temperature-resistant substrate and the second high-temperature-resistant substrate; first surface-acoustic-wave temperature sensors and surface-acoustic-wave pressure sensors are formed on a first surface of the first high-temperature-resistant substrate located in the cavity, and second surface-acoustic-wave temperature sensors are formed on a second surface of the first high-temperature-resistant substrate opposite the first surface; and the first surface-acoustic-wave temperature sensors, the second surface-acoustic-wave temperature sensors, and the surface-acoustic-wave pressure sensors are electrically connected to one another.