SAW Package Support Layout to Prevent Cover Layer Wrinkles
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Solution Overview
Problem
Surface acoustic wave devices with wafer level package (WLP) structures face challenges in mold resistance and lamination properties due to wrinkles and thickness issues when resin cover layers are attached, leading to reduced reliability.
Innovation Solution
The use of vertically arranged partition-support layers with a specific configuration, including first and second partition-support layers that extend in parallel directions, reduces the likelihood of wrinkles and maintains uniform thickness, enhancing mold resistance and lamination properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a partition-support layer with a crank shape extending in both longitudinal and lateral directions is provided, then reinforcement strength and mold resistance are improved, but wrinkles are generated in the cover layer and lamination property deteriorates
Solution Approach 1:
The partition-support layer is divided into multiple straight-line segments arranged in parallel rather than a single continuous crank shape. This segmentation eliminates the curved portions that cause cover layer wrinkles while maintaining the partitioning function for reinforcement.
Solution Approach 2:
Instead of using a crank shape that extends in both directions (which causes wrinkles), the invention inverts the approach by using straight-line segments that extend only in the longitudinal direction. This inversion of the geometric configuration resolves the lamination issue while preserving mold resistance.
2Strength
If the partition-support layer extends in both longitudinal and lateral directions to partition the hollow space, then reinforcement strength is enhanced, but the cover layer is crushed and manufacturing precision is reduced
Solution Approach 1:
The partition-support structure is segmented into multiple straight-line segments positioned parallel to each other. This segmentation removes the lateral extension components that cause cover layer crushing, allowing uniform thickness while maintaining reinforcement through the distributed straight segments.
Solution Approach 2:
The partition-support layers provide sufficient reinforcement strength through their arrangement and material properties without excessively extending in the lateral direction. This partial action approach achieves the needed reinforcement while avoiding the harmful effects of lateral extension on cover layer integrity.
3Stress or pressure
If a crank-shaped partition-support layer is used to improve mold resistance, then pressure resistance is enhanced, but wrinkles are generated and reliability is reduced
Solution Approach 1:
The partition-support function is achieved through multiple straight-line segments rather than a continuous crank shape. This segmentation maintains the pressure resistance needed for mold resistance while eliminating the wrinkle-generation mechanism, thereby improving overall device reliability.
Solution Approach 2:
The invention converts the potentially harmful crank shape into beneficial straight-line segments. By removing the curved portions that cause wrinkles, the straight segments provide clean, wrinkle-free support that maintains pressure resistance while improving reliability through better lamination properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the mold resistance, lamination property, and reliability of surface acoustic wave devices by minimizing wrinkles and maintaining uniform thickness during resin attachment, while also increasing the electrode-design area.
Implementation Method 1
interdigital transducer (IDT) electrodes are provided on a piezoelectric substrate
Data Source
AI summary
A surface acoustic wave device includes a piezoelectric substrate, an interdigital transducer electrode that is disposed on a main surface of the piezoelectric substrate, a plurality of partition-support layers each of which is arranged in a region of the main surface surrounded by an outer periphery of the main surface, and a cover layer that is disposed above the plurality of partition-support layers and that covers the interdigital transducer electrode. The plurality of partition-support layers include a first partition-support layer and a second partition-support layer that are adjacent to each other, and a portion of the first partition-support layer and a portion of the second partition-support layer do not overlap each other when viewed from a second direction perpendicular or substantially perpendicular to a first direction in which the plurality of partition-support layers extend.


