Single Crystal Ingot Sawing Slurry Distribution Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing single crystal ingot sawing processes using wire saws face issues with slurry distribution, leading to nonuniform wafer slicing, excessive cooling, and deformation due to scattered or accumulated slurry, resulting in poor wafer quality and nanotopography errors.
Innovation Solution
A single crystal ingot sawing apparatus with a slurry bath and guide rollers is designed to control slurry distribution, featuring a slurry bath on both sides of the ingot with grooves for the wire saw and a slurry blocking cover to prevent slurry scattering, ensuring uniform slurry supply and preventing deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If slurry is supplied onto the wire saw during slicing, then slicing and lubricating functions are achieved, but scattered slurry permeates and accumulates between wafers causing deformation and nonuniform shape
Solution Approach 1:
The invention divides the slurry supply system into multiple nozzles positioned at different locations along the wire saw path. Each nozzle supplies slurry to a specific section, preventing excessive accumulation between wafers while ensuring adequate lubrication and slicing performance at each stage of the cutting process.
Solution Approach 2:
The invention implements location-specific slurry supply by positioning nozzles at different distances from the wire saw and adjusting their individual flow rates. This ensures that slurry is supplied uniformly at sections where it is needed while reducing or eliminating supply at sections where accumulation would cause deformation, thereby achieving local optimization of both slicing function and wafer shape uniformity.
2Object-affected harmful factors
If slurry flow amount is reduced at the rear end of the ingot, then scattered slurry influence is minimized, but slurry curtain phenomenon does not occur leading to slicing quality degradation
Solution Approach 1:
The invention employs adjustable flow rate nozzles that can be independently controlled at different positions along the wire saw path. This dynamic control system allows the slurry flow amount to be optimized at each section - maintaining sufficient flow at the rear end to prevent wire overheating and ensure slicing quality, while controlling the flow to prevent scattered slurry accumulation that would cause wafer deformation.
3Ease of manufacture
If slurry is supplied uniformly along the entire wire saw path, then slicing function is maintained, but excessive slurry accumulates between wafers causing deformation
Solution Approach 1:
The invention implements location-specific slurry supply by positioning nozzles at different distances from the wire saw and adjusting their individual flow rates. This ensures that slurry is supplied uniformly at sections where it is needed while reducing or eliminating supply at sections where accumulation would cause deformation, thereby achieving local optimization of both slicing function and wafer shape uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus improves wafer shape uniformity, reduces waviness, and enhances nanotopography by stabilizing slurry supply, achieving better slicing quality and reducing deformation and waviness issues.
Implementation Method 1
a slurry bath for configured to receive slurry supplied onto the wire saw
Implementation Method 2
a slurry bath for configured to receive slurry supplied onto the wire saw
Implementation Method 3
the slurry (abrasive + oil) acting as slicing and lubricating agents in the wire saw
Implementation Method 4
the slurry (abrasive + oil) acting as slicing and lubricating agents in the wire saw
Implementation Method 5
A plurality of guide rollers may be provided along a movement direction of the wire saw
Data Source
Figure 1~3
Figure 4~6
Figure 7~9
AI summary
Provided is a single crystal ingot sawing apparatus. The A single crystal ingot sawing apparatus includes a wire saw configured to slice an ingot, a roller for configured to drive the wire saw, and a slurry bath for configured to receive slurry supplied onto the wire saw.