Small-Angle X-Ray Scatterometry for HAR Feature Measurement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current X-ray scatterometry techniques face challenges in accurately measuring the geometrical structures of semiconductor devices, particularly high aspect ratio (HAR) holes, due to manufacturing imperfections that lead to misalignment and orientation issues, and the need for precise angular measurements to extract information about arrays of HAR holes.
Innovation Solution
The development of a SAXS system that includes a motorized stage, X-ray source, detector, and processor to analyze X-rays scattered from semiconductor samples, utilizing beam conditioning assemblies, slit assemblies, and beam blockers to improve angular resolution and sensitivity, allowing for precise measurement of HAR features and their orientations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional X-ray scatterometry techniques are used, then measurement capability is provided, but measurement precision is insufficient for HAR features due to manufacturing imperfections and misalignment
Solution Approach 1:
The patent changes the measurement parameters by implementing angular scanning across multiple incident angles (e.g., -5 degrees to +5 degrees) and utilizing small-angle scattering geometry. This transforms the measurement approach from conventional fixed-angle scatterometry to a multi-angle SAXS technique that can accurately resolve HAR feature dimensions and orientations despite manufacturing variations and misalignments.
Solution Approach 2:
The patent adds the angular dimension to the measurement process by scanning the incident X-ray beam across a range of angles relative to the sample surface. This dimensional expansion allows the system to extract additional information about HAR feature geometry, including height, width, and orientation, thereby improving measurement precision without sacrificing reliability.
2Measurement precision
If measurement sensitivity is increased for small geometrical changes, then measurement precision improves, but device complexity increases
Solution Approach 1:
The patent implements a multi-functional SAXS system where a single integrated apparatus performs multiple measurement functions: determining HAR feature dimensions (height, width), measuring orientation angles, and characterizing geometrical structures. The system uses a shared X-ray source, sample stage, and detector assembly that can operate across multiple incident angles, eliminating the need for separate measurement devices and reducing overall system complexity while maintaining high measurement precision.
3Measurement precision
If angular resolution is improved for orientation analysis, then measurement precision increases, but the footprint of the measurement system increases
Solution Approach 1:
The patent employs dynamic measurement approaches where the incident X-ray beam angle is scanned across a range of values using a motorized goniometer or rotating sample stage. This dynamic angular scanning allows the system to achieve high angular resolution for orientation analysis without requiring a physically large fixed-angle detector array, thereby maintaining a compact system footprint while improving measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enhances the sensitivity and accuracy of measuring small geometrical changes in HAR features, reduces the footprint of the measurement system while maintaining high sensitivity and resolution, and enables precise alignment and orientation analysis of HAR holes.
Implementation Method 1
X-ray scatterometry techniques are used for measuring geometrical structures of semiconductor devices
Implementation Method 2
utilizing beam conditioning assemblies, slit assemblies, and beam blockers to improve angular resolution and sensitivity
Implementation Method 3
detector, and processor to analyze X-rays scattered from semiconductor samples
Data Source
AI summary
An x-ray apparatus includes a mount that is configured to hold a sample and an x-ray source that is configured to direct an x-ray beam toward a first side of the sample. A small angle x-ray scattering (SAXS) detector is positioned downstream to a second side of the sample, and configured to detect at least a part of a SAXS pattern formed by x-rays that have been transmitted through the sample and exited through the second side. An x-ray fluorescence (XRF) detector is configured to detect fluorescent x-rays emitted from the sample, wherein the XRF detector comprises an aperture.