Embedded Scaffold Stiffener Structure for Package Substrate Warpage
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Solution Overview
Problem
Conventional semiconductor device substrates face challenges in controlling warpage, which becomes more difficult as package footprints increase and thickness reduces, impacting high-yield integration into end devices.
Innovation Solution
Incorporating an embedded scaffold stiffener with vertically stacked scaffold columns and layers within the package substrate, which includes metal layers, stubs, dielectric layers, and vias, to provide additional structural support and reduce warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If package footprint increases and thickness reduces, then integration density improves, but warpage control becomes more difficult
Solution Approach 1:
The substrate is segmented into multiple functional layers including a core substrate layer, a scaffold layer with stiffening features, and a dielectric layer. This segmentation allows each layer to be optimized independently for its specific function while working together to control warpage in high-density packages.
Solution Approach 2:
The scaffold layer incorporates stiffening features such as recesses, protrusions, and varying thickness regions that provide localized mechanical support where needed. This local quality enhancement allows warpage control in specific critical areas without adding overall package height.
2Manufacturing precision
If external stiffeners or lids are added to control warpage, then warpage control improves, but device complexity increases
Solution Approach 1:
The warpage control function is merged into the substrate itself through the scaffold layer, eliminating the need for separate external stiffeners or lids. The scaffold layer is formed as an integral part of the substrate structure, reducing overall device complexity while maintaining effective warpage control.
Solution Approach 2:
The scaffold layer serves multiple functions simultaneously: it provides mechanical stiffening for warpage control, offers electrical connectivity through conductive features, and enables thermal management pathways. This multi-functionality eliminates the need for separate dedicated components.
3Manufacturing precision
If materials in substrate or mold compound are changed to control warpage, then warpage control improves, but manufacturing complexity increases
Solution Approach 1:
The scaffold layer utilizes parameter changes in its structural geometry (varying thickness, recesses, protrusions) rather than changing material composition to achieve warpage control. This approach maintains compatibility with existing material systems while providing the necessary mechanical control.
Data Source
AI summary
In an aspect, an apparatus may include a package substrate including a metallization structure disposed in the package substrate. The metallization structure includes a plurality of conductive layers and a plurality of dielectric layers. The package substrate includes an embedded scaffold stiffener disposed on a perimeter of the metallization structure outside the metallization structure. The embedded scaffold stiffener includes a plurality of scaffold columns and a plurality of scaffold layers stacked vertically.