Scalable DSP Architecture via Modular Segmentation
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Solution Overview
Problem
Current on-board satellite digital signal processing systems face challenges in scalability, signal integrity, and efficient testing due to the limitations of traditional back-plane solutions, which are not fully scalable and require extensive re-design and re-qualification for different mission sizes, and often result in inefficient mass usage and delayed environmental qualification testing.
Innovation Solution
A scalable architecture comprising physically distinct processing modules connected by high-speed digital interconnections, allowing for flexible configuration and phased testing, where modules can be independently tested and swapped, enabling efficient signal processing and redundancy management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a back-plane solution is used for digital signal processing, then mechanical structure and shielding are provided, but scalability is limited and re-design is required for different mission sizes
Solution Approach 1:
The system is divided into multiple independent processing modules that can be connected through standardized interfaces. Each module handles specific signal processing functions and can be independently configured, allowing the system to be scaled by adding or removing modules rather than redesigning the entire back-plane structure.
Solution Approach 2:
The processing modules are designed with universal interfaces and standardized connection protocols that allow them to function in various configurations. The same module type can serve different processing roles depending on how modules are interconnected, eliminating the need for mission-specific redesigns.
2Productivity
If a back-plane solution is used for digital signal processing, then interconnection is provided, but mass consumption increases and testing is delayed
Solution Approach 1:
By segmenting the system into separate processing modules, each module can be tested independently before integration. This phased testing approach allows environmental qualification testing to be performed on smaller units rather than the entire system, improving testing efficiency and reducing the mass that must be qualified.
Solution Approach 2:
Processing modules can be pre-tested and environmentally qualified before final system integration. This preliminary action allows testing to be performed on smaller, lighter components rather than the complete system, reducing overall mass consumption while maintaining testing thoroughness.
3Productivity
If the number of inputs and outputs is increased, then processing capacity is improved, but cross-connection requirements increase substantially
Solution Approach 1:
The cross-connection complexity is segmented across multiple processing modules, each handling a subset of inputs and outputs. Rather than requiring a single complex back-plane to manage all cross-connections, the burden is distributed across multiple standardized module interfaces, making the system more manageable and scalable.
Solution Approach 2:
Processing modules act as intermediary units between inputs and outputs. Each module provides standardized interfaces that simplify the connection process, acting as mediators that manage cross-connections locally rather than requiring global routing through a complex back-plane structure.
Data Source
AI summary
Architecture is described for implementing digital signal processors, defined by a plurality of physically distinct processing modules connected by high speed digital interconnections in which a first plurality of first modules have a plurality of analog or digital signal inputs and arranged to perform a first set of digital processing functions and produce a first plurality of digital interconnection outputs, a second plurality of second modules are arranged to receive the first plurality of digital interconnection outputs and perform a second set of digital processing functions and produce a second plurality of digital interconnection outputs, and a third plurality of third modules are arranged to receive the second plurality of digital interconnection outputs and perform a third set of digital processing functions and produce a plurality of analog or digital signal outputs, wherein the architecture is scalable by selection of the number of first modules, the number of second modules and the number of third modules and the interconnections between them such that the signal processing required of a digital signal processor is achieved through the distribution of the processing over the combination of the selected numbers of first, second and third modules.