Scalable Electronic Modules Standard Form Factor

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Solution Overview

Problem

Electronic control modules (ECMs) in vehicles have specific form factors and designs that are not scalable, making it difficult to add or remove sensors and cameras without significant hardware and software changes, leading to increased development and validation costs and manufacturing complexity.

Innovation Solution

The implementation of ECMs with a standard form factor and modular design allows for the easy addition of sensors and cameras, using a common connector pinout and power distribution across modules, enabling scalable and repeatable installations without redesigning the entire ECM.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If ECMs are designed with specific form factors for different functions, then each ECM can be optimized for its specific functionality, but the device complexity increases and scalability decreases

Engineering Contradiction:
ImprovescalabilityVSAvoidform factor variation
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent implements a universal ECM platform with standardized form factors, connector pinouts, and mechanical mounting features that can accommodate multiple functions. Different ECMs share the same physical dimensions, connector locations, and mounting hole patterns, allowing a single platform to serve multiple vehicle functions while maintaining scalability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The ECM design segments the system into modular functional units that can be independently configured while maintaining a common physical platform. Each ECM contains function-specific components (processors, memory, interfaces) that can be customized without changing the overall form factor or connector configuration, enabling functional differentiation within a standardized framework.

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If sensors and cameras are added to ECMs, then the functionality and versatility of the system improve, but hardware and software changes become extensive and costly

Engineering Contradiction:
ImprovefunctionalityVSAvoiddevelopment cost
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The standardized connector pinout includes dedicated pins for sensor and camera interfaces (such as MIPI, USB, Ethernet) that are available across all ECMs in the platform. This universal interface design allows sensors and cameras to be added to any ECM without requiring custom connector designs or extensive hardware modifications, reducing development costs while maintaining functionality.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The ECM platform provides dynamic configurability through software and firmware that can be adapted to support different sensor and camera configurations. The standardized hardware platform allows the same physical ECM to be software-configured for different functions, enabling flexible addition of sensors and cameras without extensive hardware redesign.

Inventive Principle:
Principle #15Dynamics

3Reliability

If ECMs are designed with custom form factors for specific functions, then optimization for that function is achieved, but manufacturing complexity and validation costs increase

Engineering Contradiction:
Improvefunction-specific optimizationVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent establishes a universal mechanical interface standard including standardized mounting hole patterns, connector locations, and overall dimensions. This allows ECMs to be manufactured using common processes and assembly procedures while still achieving function-specific optimization through internal component configuration rather than external form factor variation.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

While the overall form factor is standardized, the patent allows for local variations in specific components or regions of the ECM that are necessary for function-specific optimization. For example, heat dissipation features, antenna locations, or specific component placements can be customized locally without affecting the standardized interface and mounting features.

Inventive Principle:
Principle #3Local quality

4Adaptability or versatility

If different ECMs are designed for different vehicle functions, then each ECM can be optimized for its purpose, but the space requirements and installation complexity increase

Engineering Contradiction:
Improvevehicle function coverageVSAvoidspace requirements
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The standardized form factor enables multiple ECMs to be installed in the same physical space using a common mounting platform. The uniform dimensions and mounting interfaces allow ECMs to be stacked or arranged in standardized configurations, reducing the total space required compared to custom-form-factor ECMs that would require dedicated mounting locations for each unique size and shape.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS11688962B2Scalable electronic modules having a common form factor
Publication Date: 2023.06.27 MAGNA ELECTRONICS LLC
  • US11688962B2 patent drawing
  • US11688962B2 patent drawing
  • US11688962B2 patent drawing

AI summary

An electronic system for a vehicle includes: a first module including: a first circuit board having a predetermined form factor; a first module on the first circuit board and including a plurality of pins; a first electrical connector disposed on a first surface of the first circuit board and including a plurality of pins; and a plurality of electrical conductors connecting the pins of the first electrical connector with the pins of the first module, respectively; and a second module including: a second circuit board having the predetermined form factor; a second module on the second circuit board and including a plurality of pins; a second electrical connector disposed on a first surface of the second circuit board and including a plurality of pins, the second electrical connector coupled to the first electrical connector.