Scalable HPEC Pod With Conduction Cooling
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Solution Overview
Problem
Current high-performance embedded computing (HPEC) systems are not sufficiently scalable, adaptable, and exceed size, weight, and power constraints, making them unsuitable for various applications such as real-time processing in unmanned aircraft systems and other environments.
Innovation Solution
A scalable HPEC system utilizing a flight-certified aeronautics pod with a lightweight, thermally-efficient conduction-cooled chassis and RF transparent materials, supporting multiple processing boards and software for real-time processing, connected to external data sources, and designed for environmental sealing and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If current HPEC systems are used to achieve high computational capability, then processing power is improved, but size, weight, and power constraints are exceeded
Solution Approach 1:
The system is divided into modular functional units including processing boards, memory modules, and cooling components that can be independently selected and configured. This segmentation allows optimization of each component's weight while maintaining overall computational capability.
Solution Approach 2:
The patent changes the cooling parameter from traditional liquid cooling to air cooling, significantly reducing system weight and complexity while maintaining adequate thermal management for high-performance computing operations.
2Productivity
If current HPEC systems are used to achieve high computational capability, then processing power is improved, but system size increases
Solution Approach 1:
Components are nested within a compact enclosure structure where processing boards are vertically stacked and cooling channels are integrated within the chassis walls. This nesting approach maximizes computational density while minimizing external dimensions.
Solution Approach 2:
The system transitions from horizontal component layout to vertical stacking arrangement, utilizing the third dimension to increase computational capability without proportionally increasing the system's footprint on the mounting surface.
3Productivity
If current HPEC systems are used to achieve high computational capability, then processing power is improved, but power consumption increases
Solution Approach 1:
The patent replaces traditional mechanical cooling systems with passive air cooling channels, eliminating the need for energy-consuming pumps and heat exchangers while maintaining effective thermal management for high-power computing components.
Solution Approach 2:
The cooling system is designed to utilize natural convection and ambient air flow to remove heat from processing components, making the thermal management system self-regulating without requiring external power input for cooling operations.
4Productivity
If current HPEC systems are used to achieve high computational capability, then processing power is improved, but adaptability decreases
Solution Approach 1:
The chassis design incorporates universal mounting interfaces and standardized board formats that can accommodate different types of processing boards, memory modules, and peripheral devices, allowing the same physical platform to be adapted for various computational applications and mission requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides increased computational capability within restrictive size, weight, and power constraints, enabling efficient real-time processing and adaptability for diverse applications, including ISR missions, while maintaining a high ratio of processing power to energy consumption.
Implementation Method 1
an air inlet configured to receive ambient air, an air duct configured to receive the ambient air from the air inlet and deliver it to the interior of the aeronautics pod
Implementation Method 2
a lightweight, thermally-efficient conduction cooled chassis
Data Source
AI summary
Methods and systems for scalable high-performance embedded computing architectures. According to an embodiment, a scalable high-performance embedded computing system increases computational capability within the restrictive size, weight, and power constraints of systems such as the external pod payloads of unmanned aircraft systems, among many other possible systems. The core computer capability can be placed in various environments, and according to one embodiment utilizes a flight-certified aeronautics pod that is scalable in length. The scalable HPEC system can be connected to external data sources, or the nose and tail can be made of Radio Frequency transparent material, enabling the use of various RF sensing technologies within the same aeronautics enclosure. According to an embodiment, a lightweight, thermally-efficient conduction cooled chassis supports the required board and interface hardware.