Scalable IO Connector With Integrated Buffer and Voltage Regulator
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Solution Overview
Problem
Current input/output (IO) connector technologies, such as USB and PCI Express, face limitations in scalability and bandwidth, particularly for emerging applications that require higher data transfer rates and power capacity, leading to potential signal degradation and insufficient current supply for future devices like flash memory and high-definition displays.
Innovation Solution
A scalable IO connector design featuring a substrate with integrated buffer chips and multiple rows of contacts, allowing for higher bandwidth and power capacity, with a housing configuration that supports multiple generations of devices, including integrated voltage regulators and dynamic power management to optimize performance and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If existing USB and PCI Express connector technologies are used, then current bandwidth requirements are met, but signal degradation occurs at frequencies below 10 GHz and bandwidth scalability is limited
Solution Approach 1:
The connector is divided into multiple independent contact rows (e.g., 8 rows with 5 contacts each), allowing selective activation of contact groups. This segmentation enables bandwidth scalability from 32 Gb/s to 512 Gb/s or more while maintaining signal integrity by activating only the necessary number of high-frequency contacts for the required data rate.
Solution Approach 2:
The patent transitions from traditional single-plane contact arrangements to a three-dimensional contact matrix structure with multiple stacked rows. This dimensional change allows simultaneous support for multiple frequency bands and data rates within a single connector, enabling frequencies beyond 10 GHz while maintaining reliability through optimized signal paths.
2Productivity
If USB connector capabilities are expanded to meet future bandwidth demands, then higher data transfer rates are achieved, but the connector reaches its scalability limit
Solution Approach 1:
The connector incorporates dynamic power management capabilities with integrated voltage regulators that can adjust power delivery based on the active contact configuration. This allows the same physical connector to dynamically adapt its electrical characteristics for different bandwidth requirements, from 32 Gb/s to 512 Gb/s or higher, without reaching scalability limits.
Solution Approach 2:
The connector design provides multi-functionality by supporting multiple generations of devices and protocols within a single standardized interface. The ability to selectively activate different contact rows enables the connector to serve both current USB 3.0 devices and future high-bandwidth applications, achieving universal compatibility across multiple technology generations.
3Power
If power capacity is increased to support future devices like flash memory and high-definition displays, then current consumption requirements are met, but electromagnetic interference increases
Solution Approach 1:
The connector implements local quality optimization by providing different power delivery capabilities to different contact rows. High-power contacts are concentrated in specific rows that can be selectively activated, allowing 4A current capacity to be delivered only where needed while maintaining lower electromagnetic interference in other areas. This localized power distribution reduces overall EMI while meeting high power requirements.
Data Source
AI summary
Methods and systems may include an input/output (IO) interface that has an integrated buffer, a housing and a substrate disposed within the housing. The substrate may include a first side, a second side and a connection edge. The integrated buffer can be coupled to at least one of the first side and the second side of the substrate. A plurality of rows of contacts may be coupled to the first side of the substrate. Each row of contacts can be stacked substantially parallel to the connection edge. The substrate may have power outputs coupled thereto and the integrated buffer can include a voltage regulator that has a supply output coupled to the power outputs.