Scalable Quantum Module Alignment Using Engineering Surface Plates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing ion trap quantum computers face challenges with misalignment and errors due to lateral or height discrepancies among modules, which can lead to operational failures and require numerous actuators and detectors, occupying valuable space and limiting scalability.
Innovation Solution
A method involving a top plate with supports, using a conformal affixent to attach an engineering surface plate, ensuring flatness of module distal ends, and applying normalized strains to maintain module alignment, eliminating the need for actuators and detectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If numerous actuators and detectors are used to correct misalignment between modules, then alignment precision is improved, but device complexity and space occupation increase
Solution Approach 1:
The patent applies preliminary action by precisely positioning and fixing modules during the manufacturing process using a common base plate with machined mounting surfaces. Modules are aligned and secured before operation, eliminating the need for active actuators and detectors during runtime. This upfront precision work resolves the contradiction by achieving high alignment precision without adding device complexity.
Solution Approach 2:
The patent extracts the alignment correction function from the operational phase and moves it to the manufacturing phase. By removing actuators and detectors that would otherwise be needed for runtime alignment correction, the system achieves high precision through static positioning alone, thereby reducing device complexity while maintaining alignment precision.
2Stability of the object's composition
If numerous actuators and detectors are installed to maintain module alignment, then alignment stability is improved, but the space available for quantum components is reduced
Solution Approach 1:
The patent implements preliminary action by establishing precise mechanical alignment and rigid fixation of modules to a common base plate during manufacturing. This upfront positioning ensures long-term alignment stability without requiring additional actuators or detectors that would consume valuable space. The stable alignment is achieved through careful mechanical design and assembly procedures rather than active control components.
3Manufacturing precision
If modules are tightly coupled to ensure flatness and alignment, then manufacturing precision is improved, but thermal expansion effects increase
Solution Approach 1:
The patent applies parameter changes by carefully selecting materials with matched thermal expansion coefficients for the base plate, supports, and module housings. This material parameter selection allows modules to be tightly coupled for precise flatness while minimizing differential thermal expansion effects. The contradiction is resolved by changing material parameters rather than loosening mechanical coupling.
Solution Approach 2:
The patent employs composite material strategies by using materials with complementary properties - the base plate and supports are constructed from materials that provide both the rigidity needed for precise flatness and thermal stability. This composite approach allows tight coupling of modules while compensating for thermal expansion effects through material selection rather than mechanical design alone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures seamless ion transfer between modules by maintaining flatness, enhancing scalability and reducing operational risks, while minimizing space usage and thermal expansion effects.
Implementation Method 1
adhering the proximal ends of the supports to the top plate using a conformal affixent
Implementation Method 2
bringing the engineering surface plate into contact with all of the distal ends of the supports while the conformal affixent cures; applying a predetermined force to the engineering surface plate towards the plurality of supports
Implementation Method 3
The top plate and the supports have a differential coefficient of thermal expansion of less than 4 ppm. The supports and the modules have a differential coefficient of thermal expansion of less than 4 ppm.
Data Source
AI summary
Disclosed herein is a method of manufacturing an array of quantum computer modules, each module comprising at least a qubit gate, the method comprising: providing a top plate; providing a plurality of supports for each module, each support having a proximal end and a distal end; providing an engineering surface plate; adhering the proximal ends of the supports to the top plate using a conformal affixent; bringing the engineering surface plate into contact with all of the distal ends of the supports while the conformal affixent cures; removing the engineering surface plate after the affixent has cured; and fixing the modules to the distal ends of the supports.