Scale Conductor Patterning With Dual-Laser Metal Peeling
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Solution Overview
Problem
Existing methods for forming conductor patterns on scales either require the use of chemicals with high environmental impact or are time-consuming when using laser processing.
Innovation Solution
A manufacturing method for scales that involves forming a metal-containing layer on a resin layer, using lasers to create the outline of conductor patterns and peel off the excess metal from the edges, thereby reducing chemical usage and processing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional methods are used to form conductor patterns on scales, then the patterns can be formed with existing processes, but the processing time is long and chemicals with high environmental impact are required
Solution Approach 1:
The patent replaces conventional chemical etching processes with laser-based processing. Specifically, it uses a combination of ultrashort pulse laser irradiation to form the conductor pattern outline and subsequent peeling processing to remove excess metal. This substitution eliminates the need for chemical solutions while significantly reducing processing time, as laser processing can be performed rapidly without the multiple steps and long exposure times required for chemical methods.
Solution Approach 2:
The patent employs ultrashort pulse laser irradiation with specific temporal and spatial parameters to achieve precise metal removal. By controlling the pulse duration, energy density, and scanning speed, the process efficiently forms conductor patterns with high precision and speed. The parameter optimization allows the laser to selectively remove metal without affecting the underlying resin layer, enabling rapid pattern formation.
2Object-affected harmful factors
If conventional laser processing is used to form conductor patterns, then chemical usage is reduced, but the processing time becomes excessively long
Solution Approach 1:
The patent replaces conventional chemical etching processes with laser-based processing. Specifically, it uses a combination of ultrashort pulse laser irradiation to form the conductor pattern outline and subsequent peeling processing to remove excess metal. This substitution eliminates the need for chemical solutions while significantly reducing processing time, as laser processing can be performed rapidly without the multiple steps and long exposure times required for chemical methods.
Solution Approach 2:
The patent divides the conductor pattern formation process into two distinct stages: (1) ultrashort pulse laser irradiation to create the precise outline of the conductor pattern, and (2) peeling processing to remove the excess metal from the resin layer. This segmentation allows each stage to be optimized independently - the laser stage for precision and the peeling stage for speed - thereby achieving both high precision and high productivity without requiring chemicals.
3Manufacturing precision
If precise conductor patterns are formed using existing methods, then pattern accuracy is achieved, but the process requires multiple steps including chemical etching
Solution Approach 1:
The patent replaces conventional chemical etching processes with laser-based processing. Specifically, it uses a combination of ultrashort pulse laser irradiation to form the conductor pattern outline and subsequent peeling processing to remove excess metal. This substitution eliminates the need for chemical solutions while significantly reducing processing time, as laser processing can be performed rapidly without the multiple steps and long exposure times required for chemical methods.
Solution Approach 2:
The patent merges the pattern formation and excess metal removal operations into an integrated two-step process. The ultrashort pulse laser irradiation precisely defines the conductor pattern boundaries, and the subsequent peeling processing automatically removes excess metal based on the formed outline. This merging of operations reduces the total number of process steps compared to conventional methods that require separate etching, rinsing, and drying steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the rapid formation of conductor patterns on scales with reduced environmental impact, improving productivity and minimizing chemical waste.
Implementation Method 1
forming an outline of a pattern on the metal-containing layer by irradiating a first laser to the metal-containing layer from a side opposite to the substrate
Implementation Method 2
irradiating a second laser to a margin outside of the outline of the metal-containing layer from a side of a second face of the substrate opposite to the first face
Data Source
AI summary
A manufacturing method of a scale includes forming a metal-containing layer on a resin layer that is provided on at least a first face of a substrate, forming an outline of a pattern on the metal-containing layer by irradiating a first laser to the metal-containing layer from a side opposite to the substrate, irradiating a second laser to a margin outside of the outline of the metal-containing layer from a side of a second face of the substrate opposite to the first face, and peeling a part of the metal-containing layer corresponding to the margin.