Semiconductor Package Scale Patterns for Real-Time Bonding Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor packaging methods face challenges in precise alignment and bonding efficiency due to misalignment during the bonding process of workpieces, leading to increased production time and reduced yield rates.
Innovation Solution
The implementation of a flip chip bonding apparatus with infrared inspection devices that utilize scale patterns on semiconductor devices to detect offset values in real-time, allowing for precise alignment and adjustment, and initial inspections to eliminate defects and adjust bonding force based on topographical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional bonding methods are used without real-time inspection, then the bonding process is simpler and faster, but alignment accuracy deteriorates leading to misalignment
Solution Approach 1:
The patent applies preliminary action by placing scale patterns on workpieces before bonding and performing initial inspections to detect offset values. This allows alignment adjustments to be made before the actual bonding occurs, ensuring high alignment accuracy without adding complexity to the bonding process itself.
Solution Approach 2:
The patent implements feedback by using inspection devices to detect offset values between workpieces in real-time during the bonding process. This feedback information is used to adjust alignment dynamically, maintaining high precision while managing process complexity through automated control.
2Measurement precision
If real-time inspection and alignment adjustment are implemented, then alignment accuracy improves, but production time increases
Solution Approach 1:
The patent applies continuity of useful action by integrating inspection and alignment adjustment into the bonding process flow without interruption. The scale patterns enable continuous monitoring of alignment status, and adjustments are made seamlessly during the process rather than requiring separate inspection and repositioning steps, thus maintaining high accuracy while minimizing time loss.
3Reliability
If initial inspection to eliminate defects is performed, then yield rate increases, but production time increases
Solution Approach 1:
The patent applies preliminary action by performing initial inspection to detect defects and determine bonding force adjustments before the bonding process begins. This allows defective workpieces to be eliminated early and bonding parameters to be optimized in advance, increasing yield rate without adding time during the actual bonding operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the efficiency of the manufacturing process by improving alignment accuracy, reducing production time, and increasing the yield rate of the bonding process through real-time feedback and defect elimination.
Implementation Method 1
an infrared inspection device is configured to recognize each set of the alignment patterns
Data Source
AI summary
A semiconductor package includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first alignment pattern having a plurality of first scale patterns arranged in a first direction. The second semiconductor device is mounted over the first semiconductor device and includes a second alignment pattern having a plurality of second scale patterns arranged in a second direction parallel to the first direction, and a scale pitch of the first scale patterns is different from a scale pitch of the second scale patterns.