Scaled AFM Probe Card for Submicron Semiconductor Testing
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Solution Overview
Problem
Conventional probe cards are inadequate for accurately, efficiently, and reliably probing highly-scaled semiconductor devices with small feature sizes and high-density contact pads, such as microLEDs, due to limitations in miniaturization and scalability, which hinders the characterization of current and future fabrication processes.
Innovation Solution
The development of enhanced probe cards with individually-addressable, scaled AFM probes integrated into a backplane, allowing for precise electrical and mechanical properties modification to match the requirements of the devices-under-test, enabling efficient characterization of highly-scaled fabrication processes by matching probe tip sizes and densities with the devices' contact pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional probe cards are used for probing highly-scaled semiconductor devices, then the existing probe card structure can be maintained, but the probing accuracy and reliability deteriorate due to inability to match small feature sizes and high-density contact pads
Solution Approach 1:
The probe card employs AFM probes with modified electrical and mechanical properties including adjusted drive current, voltage, and temporal duration parameters to match the requirements of highly-scaled devices with submicron feature sizes and high-density contact pads, enabling accurate probing where conventional probes fail
Solution Approach 2:
The patent replaces conventional mechanical probing systems with atomic force microscopy (AFM) probe technology, utilizing AFM probe tips that can be precisely controlled and addressed individually to achieve the required measurement precision for highly-scaled semiconductor devices
2Measurement precision
If probe tip sizes are reduced to match small feature sizes, then probing precision improves, but probe strength and durability worsen due to excessive physical degradation
Solution Approach 1:
The AFM probes are configured with optimized electrical parameters including drive current and voltage levels, and mechanical parameters including temporal duration of contact, to enable precise probing of small contact pads while maintaining sufficient strength and minimizing physical degradation through controlled interaction parameters
3Productivity
If individually-addressable AFM probes are integrated into a backplane, then probing efficiency and characterization capability improve, but device complexity increases
Solution Approach 1:
The probe card architecture divides the probing function into individually-addressable AFM probes integrated on a backplane, allowing selective addressing and control of specific probes for specific contact pads, thereby improving characterization efficiency despite increased architectural complexity
Solution Approach 2:
The AFM probes on the backplane are designed to be universally applicable for characterizing various highly-scaled semiconductor devices including microLED arrays with different densities and configurations, enabling efficient probing across multiple device types through a single integrated system
Data Source
AI summary
Probe cards for probing highly-scaled integrated circuits are provided. A probe card includes a backplane and an array of probes extending from the backplane. Each of the probes includes a cantilever member and a probe tip. A first end of the cantilever member is coupled to the backplane, such that the cantilever member extends from the backplane. The probe tip extends from a second end of the cantilever member. The probes are fabricated from semiconductor materials. Each probe is configured to transmit electrical signals between the backplane and a device under test (DUT), via corresponding electrodes of the DUT. The probes are highly-scaled such that the feature size and pitch of the probes matches the highly-scaled feature size and pitch of the DUT's electrodes. The probes comprise atomic force microscopy (AFM) probes that are enhanced for increased electrical conductivity, elasticity, lifetime, and reliability.