Scan Stage Vacuum Adsorption for Wafer Stability

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Solution Overview

Problem

Conventional semiconductor wafer pollutant measurement apparatuses face challenges with unstable wafer loading and scanning due to the structure of the scan stage, which lacks precise control and flexibility in handling different wafer sizes and vacuum-based adsorption.

Innovation Solution

A scan stage with a rotatable adsorption plate and vacuum-controlled adsorption unit, integrated with a step motor for precise rotation and a base plate that can move up and down, along with independent support jigs for 12-inch and 8-inch wafers, and sensors for load detection, ensuring stable and precise wafer handling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional scan stage structure is used, then the apparatus is simpler, but wafer loading stability and scanning precision deteriorate

Engineering Contradiction:
Improvewafer loading stabilityVSAvoidscan stage structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The scan stage is divided into separate functional modules: a rotating body for wafer rotation, an adsorption plate for vacuum-based wafer holding, a base plate for vertical movement, and support jigs for wafer positioning. This segmentation allows each module to be optimized independently, improving overall reliability without creating an uncontrollably complex system.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The scan stage incorporates dynamic elements including a step motor for precise rotational control, a cylinder mechanism for base plate vertical movement, and vacuum-controlled adsorption. These dynamic components enable adaptive adjustment and precise positioning, significantly improving wafer loading stability and scanning precision.

Inventive Principle:
Principle #15Dynamics

2Reliability

If vacuum-based adsorption is implemented, then wafer holding stability improves, but device complexity increases

Engineering Contradiction:
Improvewafer holding stabilityVSAvoidvacuum system complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The vacuum adsorption system is integrated directly into the rotating body structure, with the adsorption plate forming an inherent part of the rotation mechanism. This merging eliminates the need for separate vacuum holding devices, reducing overall system complexity while maintaining reliable vacuum-based wafer holding.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The adsorption plate automatically engages with the wafer through vacuum pressure when the wafer is placed on it, and automatically releases when vacuum is discharged. This self-service mechanism eliminates the need for additional actuators or complex control systems, simplifying the device while ensuring stable wafer holding during rotation.

Inventive Principle:
Principle #25Self-service

3Ease of operation

If the base plate can move up and down, then accessibility to wafer lower portion improves, but structural complexity increases

Engineering Contradiction:
Improvewafer accessibilityVSAvoidbase plate mechanism complexity
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

A cylinder mechanism is used to provide controlled vertical movement of the base plate. This pneumatic/hydraulic actuation offers smooth, controlled motion with precise positioning capability, improving accessibility to the wafer lower portion while maintaining a relatively simple and reliable mechanical structure.

Inventive Principle:
Principle #29Pneumatics and hydraulics

4Adaptability or versatility

If independent support jigs are used for different wafer sizes, then adaptability improves, but device complexity increases

Engineering Contradiction:
Improvewafer size compatibilityVSAvoidjig system complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The support jigs are designed with adjustable features that allow them to accommodate multiple wafer sizes (12-inch and 8-inch wafers) using the same basic structure. This universal design approach provides adaptability for different wafer sizes while avoiding the need for completely separate jig systems, thereby controlling device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a stable and precise mechanism for wafer adsorption and scanning, enabling persistent vacuum-based adsorption and rotation, facilitating accurate pollutant collection and analysis while accommodating different wafer sizes.

Implementation Method 1

a vacuum port which is connected to a vacuum line at the bottom of the rotating body

Methodology Applied
Scientific EffectVacuum: Vacuum

Implementation Method 2

an adsorbing unit which is formed on the upper surface of the rotating body so that a wafer is adsorbed under the vacuum condition

Methodology Applied
Scientific EffectAdsorption: Adsorption

Data Source

PatentUS7975996B2Scan stage for semiconductor wafer pollutant measurement apparatus
Publication Date: 2011.07.12 KOREA TECH CO LTD
  • US7975996B2 patent drawing
  • US7975996B2 patent drawing
  • US7975996B2 patent drawing

AI summary

Provided is a scan stage for a semiconductor wafer pollutant measurement apparatus, which includes: a stage main body which comprises: a circular fixed housing; an adsorption plate which is rotatably installed in the inside of the fixed housing, at the center of which an adsorption path is formed, at the bottom of which a vacuum port is connected, and which is rotated by an external rotating force; and a step motor which is placed at the bottom of the fixed housing and connected with the adsorption plate; a base plate that is supported by pillars to form a lower space between the fixed housing of the stage main body and the base plate; a cylinder at the bottom of which a cylinder load is connected so that the base plate moves up and down; and support jigs that hold up a wafer in the outer side of the stage main body, in which three support jigs are disposed in proximity with the outer circumference of the stage main body.