Scanner Laser Machining for Precise Tapered and Zero-Taper Cutouts

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Solution Overview

Problem

Current laser machining methods struggle to produce high-quality, zero or predetermined taper cuts and holes in hard and brittle materials like stainless steel and ceramics, especially when using scanner units, which often result in tapered holes and require complex equipment and slow machining speeds.

Innovation Solution

A method that combines two machining strategies using a scanner unit, where the laser beam is directed at a near-perpendicular angle for high material removal rate and a high incidence angle for surface quality, allowing control of taper angles and enabling the formation of various hole shapes, including positive and negative conical holes, by adjusting the relative positions and orientations of the laser beam and workpiece.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If laser machining is performed with a perpendicular beam angle for high material removal rate, then productivity is improved, but manufacturing precision deteriorates due to tapered holes

Engineering Contradiction:
Improvematerial removal rateVSAvoidhole taper control
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The machining process is divided into multiple passes with different beam angles. The first pass uses a perpendicular beam angle for rapid material removal, while subsequent passes use inclined beam angles to correct taper and achieve the desired cylindrical geometry. This segmentation of the machining process allows both high productivity and precision to be achieved at different stages.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The perpendicular beam angle pass is performed as a preliminary action to quickly remove the majority of material, creating a rough cylindrical shape. This preliminary material removal enables subsequent precision passes with inclined angles to work on a smaller volume, improving both efficiency and final precision.

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If complex optical systems are used to control taper angle, then manufacturing precision is improved, but device complexity increases

Engineering Contradiction:
Improvetaper angle controlVSAvoidoptical system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

Instead of using complex optical systems with adjustable lenses and mirrors, the invention changes the parameter of beam angle in a controlled sequence. By varying the incident angle parameter between different machining passes (from 0° to inclined angles), precise taper control is achieved using the same simple optical system, avoiding the need for complex adaptive optics.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The beam angle parameter is dynamically adjusted between machining passes rather than requiring a statically complex optical system. The system transitions from a simple perpendicular beam configuration to inclined beam configurations through controlled changes in beam direction, achieving precision without increasing hardware complexity.

Inventive Principle:
Principle #15Dynamics

3Manufacturing precision

If workpiece is moved physically to achieve zero taper, then manufacturing precision is improved, but productivity decreases due to slower movement speeds

Engineering Contradiction:
Improvezero taper achievementVSAvoidmachining speed
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

Instead of moving the workpiece to achieve zero taper (as in conventional methods), the invention inverts the approach by keeping the workpiece stationary and changing the beam angle. The laser beam is directed at inclined angles during specific passes to remove tapered material, achieving zero taper without requiring slow physical movement of the workpiece, thus maintaining high productivity.

Inventive Principle:
Principle #13The other way round (Inversion)

4Manufacturing precision

If inclined beam angle is used for surface quality, then manufacturing precision is improved, but productivity decreases due to slower material removal

Engineering Contradiction:
Improvesurface qualityVSAvoidmachining speed
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The machining process is segmented into a high-speed roughing pass with perpendicular beam and a precision finishing pass with inclined beam. The perpendicular pass removes material quickly but leaves a tapered surface, while the inclined pass removes less material but produces the desired surface quality and cylindrical geometry. This segmentation allows both productivity and precision to be optimized in their respective stages.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the production of high-quality cutouts with precise taper angles, improving machining speed, accuracy, and reducing post-processing needs, while maintaining high material removal rates and flexibility, suitable for hard and superhard materials like indexable inserts.

Implementation Method 1

The impingement of the laser beam on the workpiece locally melts, vaporizes, and/or ablates workpiece material to produce or extend a hole or cut in the workpiece

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

The impingement of the laser beam on the workpiece locally melts, vaporizes, and/or ablates workpiece material

Methodology Applied
Scientific EffectMelting: Melting

Implementation Method 3

The impingement of the laser beam on the workpiece locally melts, vaporizes, and/or ablates workpiece material

Methodology Applied
Scientific EffectVaporization: Evaporation

Data Source

PatentUS20240424608A1Laser Machining Method and Device
Publication Date: 2024.12.26 AGATHON
  • US20240424608A1 patent drawing
  • US20240424608A1 patent drawing
  • US20240424608A1 patent drawing

AI summary

A method (100) and device (1) for laser machining a defined cutout in a workpiece (10), comprising generating a laser beam (20) propagating through a scanning unit (4) along a scanner axis (34), providing the workpiece (10) which is supported and held in a holder (11), and which is positionable relative to the scanner axis (34). The method further comprises defining a machining volume (22) of the workpiece (10) having a surface area (30) and a depth (d), determining a first relative position between the machining volume (22) and the scanner axis (34) in which the scanner axis (34) is orientated approximate perpendicular to a surface (21) of the machining volume (22), and positioning the workpiece (10) and/or the scanner axis (34) in the first relative position, and directing the laser beam (20) onto the machining volume (22) within the surface area (30), causing relative motion between the workpiece (10) and the laser beam (20), and scanning the laser beam (20) along a first cutting path (29). The removal of the first machining volume (22) results in a first cutout (25) with a first side wall (24) having a first taper characteristic (23). The method further includes defining a second machining volume (26) including the first side wall (24) and limited partly by a second side wall (27) with a predetermined characteristic (28), determining a second relative position between the second machining volume (26) and the scanner axis (34) and positioning the workpiece (10) and/or the scanner axis (34) in said second relative position, and orientating the scanner axis (34) relative to the workpiece (10) under a predetermined tilt angle (ß), directing the laser beam (20) onto the second machining volume (26), scanning the laser beam (20) along a second cutting path (36), and removing at least part of the second machining volume (26) to form the second side wall (27).