Scanning Unit Heat Dissipation via Solder Pressure
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Solution Overview
Problem
Position-measuring devices face challenges in achieving high resolution and accuracy due to heat generation by electrical components, which causes mechanical stresses and measurement inaccuracies, especially when operated in a vacuum where heat convection is absent.
Innovation Solution
A scanning assembly design that conducts heat generated by electrical components to a base body acting as a heat sink using solder material with a pressure element to form a thermal conduction path, allowing for efficient heat dissipation while minimizing mechanical stresses through a non-positive attachment of the carrier body on the base body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electrical components are integrated in a very small space to achieve compact structure, then device compactness is improved, but heat generation increases causing negative effects on components and measurement accuracy
Solution Approach 1:
A solder material is introduced as an intermediary substance between the carrier body and base body to establish a thermal conduction path. This solder material acts as a heat transfer mediator, conducting heat away from the electrical components while allowing for flexible thermal management in the compact scanning unit structure.
2Loss of energy
If heat is conducted to a base body using a polymer film, then heat dissipation is improved, but the solution becomes unsuitable for vacuum operation
Solution Approach 1:
The material parameter of the thermal conduction medium is changed from polymer film to solder material. This parameter change enables the system to operate in vacuum environments while maintaining effective heat dissipation, as solder materials are compatible with vacuum conditions unlike polymer films.
3Stability of the object's composition
If the carrier body is rigidly attached to the base body, then structural stability is improved, but thermal expansion causes mechanical stresses and measurement inaccuracies
Solution Approach 1:
The design explicitly accounts for thermal expansion by allowing the carrier body to be displaceable relative to the base body. This accommodates the different thermal expansion coefficients of the two components, preventing mechanical stresses and maintaining measurement accuracy under temperature variations.
4Measurement precision
If the carrier body is made displaceable to accommodate thermal expansion, then measurement accuracy is improved, but heat conduction efficiency may be reduced
Solution Approach 1:
The solder material serves a dual function as both a thermal conduction medium and a flexible connector that accommodates carrier body displacement. This intermediary enables simultaneous achievement of good heat conduction and thermal expansion compensation.
5Temperature
If a pressure element is used to press the solder material for optimal thermal contact, then heat conduction is improved, but device complexity increases
Solution Approach 1:
The pressure element is designed to serve multiple functions: it applies pressure to ensure optimal thermal contact between the solder material and the base body, while also potentially serving as a mechanical fastener or structural support element, thereby reducing the need for separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances measurement accuracy and reliability by effectively managing heat dissipation and reducing mechanical stresses, ensuring precise position measurements even in vacuum environments.
Implementation Method 1
a means for forming a thermal conduction path from the carrier body to the base body, this means comprising a solder material applied to the carrier body
Implementation Method 2
a pressure element being provided which is designed to press the solder material and the base body or to urge the solder material and an intermediate element connected to the base body to one another
Data Source
Figure 1
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Figure 4~5
AI summary
The invention relates to a scanning unit (10), comprising a light source (13), the dissipation heat of which is diverted to a heat sink (11) by way of a heat guide path. Said heat guide path is formed by a circuit board (14), to which the light source (13) is attached, and continues on to a main body (11), which serves as a heat sink. In order to optimize the heat transfer from the circuit board (14) to the main body (11, a solder material (41, 42) is applied to the circuit board (14), onto which an intermediate element (61, 62) is pressed by way of a pressure element (71, 72). As a result of the pressure applied, a tight contact between the solder material (41, 42) and the intermediate element (61, 62) is established, thus guaranteeing low heat transfer resistance. The intermediate element (61, 62), on the other hand, is connected to the main body (11).