SCARA Arm Transport for Compact Substrate Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional substrate transfer systems face challenges with increased substrate diameters, leading to larger cluster systems that occupy more space and have longer load lock pump-down times, which conflict with shorter deposition and removal processing times, and lack efficient arrangements for multiple processing modules to be placed in close proximity.
Innovation Solution
A compact substrate processing system with a SCARA arm transport mechanism that allows for direct coupling of load ports with processing modules without an equipment front end module, featuring unequal length arm links and end effectors to minimize space and pump-down time, enabling efficient substrate handling and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional cluster systems are used to process larger diameter substrates, then substrate processing capability is improved, but system size and occupied space increase significantly
Solution Approach 1:
The patent transitions from a conventional planar cluster tool arrangement to a three-dimensional configuration where processing modules are stacked vertically around a central transfer chamber. This vertical stacking allows multiple processing modules to be accommodated in a compact footprint, effectively reducing the horizontal space occupied while maintaining the capability to process large diameter substrates.
Solution Approach 2:
The patent implements a nested configuration where processing modules are arranged concentrically around a central transfer chamber. The SCARA robot arm operates within this nested structure, allowing substrates to be transferred between load ports and processing modules in a compact, space-efficient manner that maintains versatility for large substrate processing.
2Adaptability or versatility
If larger volume load locks are used to accommodate bigger substrates, then substrate handling capacity is improved, but pump-down time increases
Solution Approach 1:
The patent divides the vacuum system into separate, isolated chambers including individual load locks for each load port and separate processing chambers. This segmentation allows each load lock to be pumped down independently and simultaneously, significantly reducing the total pump-down time compared to a single large load lock, while maintaining the capacity to handle larger substrates.
Solution Approach 2:
The patent implements preliminary vacuum preparation by maintaining the transfer chamber under vacuum continuously while only the load lock is cycled between vacuum and atmospheric pressure. This allows the majority of the system to remain ready for immediate substrate processing, reducing the effective pump-down time impact on throughput.
3Ease of operation
If conventional transport chambers are used, then substrate transfer functionality is provided, but system complexity and space requirements increase
Solution Approach 1:
The patent extracts and eliminates the conventional equipment front end module (EFEM) from the system architecture. Instead, the transfer chamber with SCARA robot arm directly couples load ports to processing modules, simplifying the overall system structure while maintaining substrate transfer functionality. This extraction reduces system complexity and space requirements.
Solution Approach 2:
The SCARA robot arm with gripper serves multiple functions: it transfers substrates between load ports and processing modules, positions substrates for processing, and manages the one-touch transfer protocol. This multi-functional design reduces the need for separate specialized components, thereby reducing overall system complexity.
4Area of stationary object
If multiple processing modules are arranged in close proximity, then space efficiency is improved, but heat management and contamination control become more difficult
Solution Approach 1:
The patent segments the system into isolated vacuum chambers with individual processing modules surrounded by their own vacuum boundaries. This segmentation allows close physical proximity of modules for space efficiency while maintaining thermal and contamination isolation between modules through the vacuum barriers and selective gating.
Solution Approach 2:
The patent uses vacuum as an inert environment within each processing chamber and transfer chamber. This vacuum barrier effectively isolates processing modules from each other and from the atmospheric environment, controlling heat transfer and preventing contamination while allowing compact module arrangement.
Data Source
AI summary
A substrate processing system including a load port module configured to hold at least one substrate container for storing and transporting substrates, a substrate processing chamber, an isolatable transfer chamber capable of holding an isolated atmosphere therein configured to couple the substrate processing chamber and the load port module, and a substrate transport mounted at least partially within the transfer chamber having a drive section fixed to the transfer chamber and having a SCARA arm configured to support at least one substrate, the SCARA arm being configured to transport the at least one substrate between the at least one substrate container and the processing chamber with but one touch of the at least one substrate, wherein the SCARA arm comprises a first arm link, a second arm link, and at least one end effector serially pivotally coupled to each other, where the first and second arm links have unequal lengths.