Scattering Layer for Optoelectronic Semiconductor Devices
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Solution Overview
Problem
Existing semiconductor devices face challenges in miniaturization due to highly absorbing package bodies that reduce light emission efficiency and cause mechanical instability, as light emitted by semiconductor chips is absorbed by the package body and conversion layers, leading to reduced performance and potential damage.
Innovation Solution
A method involving the use of a flexible or rigid auxiliary carrier with semiconductor chips, a scattering layer made of radiation-stable, non-absorbing materials, and a package body composite that minimizes direct light exposure to the package body, allowing for compact design and high outcoupling efficiency by using a reflective scattering layer and strategically positioning the package body composite to extend the light propagation path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the package body composite is made highly absorbing to prevent light scattering, then light emission efficiency is improved, but the package body becomes susceptible to light-induced aging and mechanical instability
Solution Approach 1:
The invention divides the light management function into two separate components: a scattering layer made of radiation-stable material positioned between the semiconductor chip and package body, and a highly absorbing package body. This segmentation allows the scattering layer to handle light redirection while the package body provides mechanical support without suffering from light-induced degradation, thus resolving the contradiction between light emission efficiency and package body stability.
Solution Approach 2:
The scattering layer acts as an intermediary element between the semiconductor chip and the highly absorbing package body. It redirects light away from the package body while allowing the package body to maintain its highly absorbing properties for optimal light extraction, thereby protecting the package body from light-induced aging while maintaining high light emission efficiency.
2Volume of moving object
If the package body is positioned close to the semiconductor chip for compact design, then device size is reduced, but light emitted via side flanks is absorbed by the package body
Solution Approach 1:
The invention addresses the spatial conflict by introducing a scattering layer that operates in the lateral dimension. This layer redirects light that would otherwise travel laterally into the package body, allowing the package body to be positioned close to the chip for compact design while preventing lateral light absorption through optical redirection in a different spatial dimension.
3Productivity
If the package body composite is used to mount semiconductor chips in a matrix arrangement, then miniaturization is achieved, but light-induced aging causes the material to fade and become porous
Solution Approach 1:
The invention extracts the light scattering function from the package body and places it in a separate scattering layer made of radiation-stable material. This allows the package body to be highly absorbing and compact for miniaturization while the scattering layer protects it from light-induced aging by preventing direct light exposure to the package body material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances light emission efficiency by preventing absorption and mechanical instability, enabling the production of compact optoelectronic semiconductor devices with improved performance and longevity.
Implementation Method 1
a scattering layer (18) is formed, in particular a reflective scattering layer, in at least one region between adjacent semiconductor bodies (4)
Implementation Method 2
the package body composite and thus also the package body formed from the package body composite are highly absorbing, i.e. substantially black
Data Source
AI summary
A method for producing a plurality of optoelectronic semiconductor components (100) is provided, comprising the following steps: a) providing an auxiliary carrier (2); b) providing a plurality of semiconductor chips (10), wherein each of the semiconductor chips has a carrier body (12) and a semiconductor body (4) arranged on an upper side (22) of the carrier body; c) attaching the plurality of semiconductor chips on the auxiliary carrier, wherein the semiconductor chips are spaced apart from one another in a lateral direction (L) and wherein the semiconductor bodies are facing the auxiliary carrier, as seen from the carrier body; d) forming a scattering layer (18), at least in regions between the semiconductor bodies of adjacent semiconductor chips; e) forming a composite package (20); f) removing the auxiliary carrier (2); and g) individually separating the composite package into a plurality of optoelectronic semiconductor components (100).