Screen Module Support Layer Thickness Variation
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Solution Overview
Problem
In electronic devices with flexible screens, the thickness is often increased due to the need for a specific bending radius in the display panel, which is supported by a uniform thickness support layer and includes a non-reducible display driver chip.
Innovation Solution
A screen module design that uses a support layer with non-uniform thickness, where the thickness near the bent region is increased to maintain the bending radius, and the thickness near the display driver chip is reduced to minimize overall thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a uniform thickness support layer is used to ensure the bending radius of the display panel, then the bending reliability is improved, but the overall thickness of the screen module increases
Solution Approach 1:
The support layer is designed with non-uniform thickness, where the thickness varies in different regions. Specifically, the support layer has a first thickness in the first region and a second thickness in the second region, allowing different parts of the support layer to serve different functions: ensuring bending radius where needed while minimizing overall thickness in other areas.
Solution Approach 2:
The support layer is divided into multiple regions (first region and second region) with different thickness characteristics. This segmentation allows the support layer to provide targeted support where required for bending radius while reducing thickness in areas where full support is not needed, thereby resolving the contradiction between reliability and thickness.
2Reliability
If the display driver chip thickness cannot be reduced, then the chip functionality is maintained, but the electronic device thickness increases
Solution Approach 1:
The display driver chip is positioned in the second region where the support layer has a different thickness profile. By utilizing the non-uniform thickness distribution of the support layer, the chip is accommodated in a region where the overall structure can be optimized for reduced thickness while still providing necessary support and maintaining functionality.
3Manufacturing precision
If a thicker support layer is used near the bent region, then the bending radius control is improved, but the overall screen module thickness increases
Solution Approach 1:
The support layer implements local quality by having different thicknesses in different regions. The first region has a thickness optimized for bending radius control, while the second region has a reduced thickness. This local differentiation allows precise bending radius control where needed without increasing the overall screen module thickness.
Solution Approach 2:
The support layer is segmented into regions with different thickness characteristics, allowing the first region to provide precise bending radius control while the second region contributes to overall thickness reduction. This segmentation resolves the contradiction between manufacturing precision and overall dimensions.
Data Source
AI summary
A screen module uses a bendable display panel including a first panel layer and a second panel layer. A support layer is located between the first panel layer and the second panel layer. The first panel layer and the second panel layer are connected by a bent region, and a thickness of the support layer close to the bent region is greater than a thickness of a first region of the support layer. A projection of the first region of the support layer on the first panel layer overlaps with a projection of a display driver chip on the first panel layer. After being stacked, the thickness of the screen module may be reduced to meet the user's requirement for a small thickness of an electronic device.