Screen Printed PCB Through-Hole Electrical Connection
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Solution Overview
Problem
Existing electrical connection methods for printed circuits, particularly when connecting thin conductors like FPCs and FFCs, are complex and prone to short circuits, especially at narrow pitches, due to the need for conductive adhesives and multiple processing steps.
Innovation Solution
The method involves forming through holes in a base material that overlap with thin conductors and filling these holes with conductive paste during the screen printing process to create the printed circuit, eliminating the need for conductive adhesives and simplifying the manufacturing procedure while reducing the risk of short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive adhesive is applied to connect printed circuit and thin conductor, then electrical connection is achieved, but manufacturing complexity increases and short circuit risk increases
Solution Approach 1:
The patent merges the through-hole formation process with the conductive paste printing process. The conductive paste is printed through a screen that has openings aligned with the through-holes, so that the paste is deposited directly into the holes during the same operation used to create the printed circuit patterns. This eliminates the need for separate adhesive application steps while maintaining reliable electrical connections.
Solution Approach 2:
The patent extracts the conductive connection function from the adhesive layer and integrates it directly into the printed circuit pattern itself. By using conductive paste printed through the screen during circuit formation, the connection function is built into the circuit structure rather than being added as a separate adhesive layer, thereby simplifying the manufacturing procedure.
2Reliability
If conductive adhesive is used for narrow pitch circuits, then electrical connection is achieved, but short circuit between adjacent circuits occurs
Solution Approach 1:
The patent applies local quality by using the screen printing process to deposit conductive paste only in specific locations where through-holes are present. The screen has openings precisely positioned over the through-holes, so conductive paste is deposited only where needed for electrical connections, not across the entire circuit area. This localized deposition prevents short circuits between adjacent narrow-pitch circuits while ensuring reliable connections at connection points.
3Reliability
If multiple processing steps are used for electrical connection, then connection reliability is improved, but manufacturing time increases
Solution Approach 1:
The patent combines multiple processing steps into a single screen printing operation. The steps that are merged include: forming through-holes in the substrate, depositing conductive paste into the through-holes, and creating the printed circuit patterns on the surface. All these functions are achieved simultaneously by printing through a screen with strategically placed openings, thereby reducing manufacturing time while maintaining connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process and reduces the likelihood of short circuits by using conductive paste to fill through holes, allowing for stable and flexible electrical connections without the need for additional adhesive application.
Implementation Method 1
forming the printed circuit on the base material by a screen printing method using conductive paste
Data Source
AI summary
An electrical connection method of a printed circuit includes overlapping a base material and a thin member in which a thin conductor is mounted, forming a through hole which passes through the base material overlapped with the thin member in the overlapping and reaches the thin conductor of the thin member, and forming a printed circuit on the base material by a screen printing method using conductive paste. The through hole formed in the forming of the through hole is filled with the conductive paste in the forming of the printed circuit.