Screen-Printing Conductive Paste on Dry Fiber Fabric for Embedded Composites
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Solution Overview
Problem
Conventional methods for embedding functionalities in composite parts often result in delamination and damage to the structural integrity of the composite, particularly due to the integration of electronic components, which undermines the interlaminar shear strength and resin infiltration processes.
Innovation Solution
The method involves printing electronic assemblies such as conductive tracks and sensors on a dry non-conductive fiber fabric, which is then integrated into the composite structure during the manufacturing process, using screen-printing or micro-dispensing techniques, allowing for the embedding of functionalities without compromising the mechanical integrity of the composite.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are integrated into composite structures during the laminating process, then functionalities such as sensing and actuating are achieved, but the structural integrity and interlaminar shear strength are undermined
Solution Approach 1:
The patent divides the composite structure into separate functional layers and structural layers. Electronic components are integrated into specific layers (such as the skin layer or core layer) rather than being embedded throughout the entire laminate, allowing the structural integrity of other layers to be maintained while still achieving the desired functionalities.
Solution Approach 2:
The patent introduces intermediary elements such as conductive foils, metallic meshes, or specialized functional layers that serve as mediators between the electronic components and the composite structure. These intermediaries allow for functional integration while maintaining the structural properties of the composite material.
2Adaptability or versatility
If functional devices are embedded within composite structures, then multifunctionality is achieved, but the resin infiltration process is blocked and dry spots are generated
Solution Approach 1:
The patent applies local quality by placing functional devices only in specific locations where they are needed, rather than throughout the entire composite structure. This localized integration minimizes the impact on resin infiltration pathways and prevents blockage of resin flow during the manufacturing process.
Solution Approach 2:
The patent transitions from two-dimensional planar integration of functional devices to three-dimensional spatial integration, where devices are positioned at specific depths and locations within the composite structure. This dimensional approach allows resin to flow around devices rather than being blocked by them.
3Reliability
If functionalities are added to composite parts, then sensing and monitoring capabilities are improved, but the mechanical integrity is compromised
Solution Approach 1:
The patent merges functional elements with structural elements by integrating sensors, conductors, and other functional components directly into the composite laminates during manufacturing. This merging allows the functional and structural roles to be fulfilled simultaneously without compromising mechanical integrity, as the integration is done at the material level rather than as separate attachments.
Data Source
AI summary
A method of manufacturing a polymer composite having an embedded functionality includes the following steps: providing a dry non-conductive fiber fabric having a nominal weight from 25-600 g/m2; selecting a paste having viscosity below 600 Pa-s, the paste being a conductive paste, dielectric paste and/or a sensing paste; and applying the selected paste on the dry non-conductive fiber woven fabric by either screen-printing or micro-dispensing, thus making a printed functionality. The method further includes the step of forming a laminate having the dry non-conductive fiber woven fabric having the printed functionality and at least one additional fabric or core; and obtaining a polymer composite from the laminate.