Screwless Semiconductor Chamber Assembly Using Geometric Interlocking

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Solution Overview

Problem

Conventional semiconductor chamber component assembly using screws is prone to damage and corrosion, leading to unsatisfactory manufacturing outcomes due to the locking and loosening processes.

Innovation Solution

The implementation of screwless semiconductor chambers where components are assembled using mortise and tenon joints, inner spirals, location pinning, and snap connections, eliminating the need for screws and nails, and allowing assembly via gravity and non-rigid adherence.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If screws are used to assemble chamber components, then the components can be securely fastened together, but the components and screws may incur damage during locking and loosening and screws may corrode over time

Engineering Contradiction:
Improveassembly reliabilityVSAvoiddamage and corrosion
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent removes screws entirely from the assembly system and replaces them with a screwless coupling mechanism. The chamber components are designed with complementary geometric features (protrusions and recesses) that interlock without requiring fastening elements, thereby eliminating the source of damage and corrosion while maintaining secure assembly.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the mechanical screw-fastening system with a geometric interlocking system. Instead of using threaded fasteners that require locking and loosening actions, the design uses shape-complementary interfaces where components are inserted and retained through geometric constraints, eliminating the harmful mechanical actions associated with screw assembly and disassembly.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Strength

If screws are used for chamber component assembly, then components can be held together, but the assembly process becomes complex and time-consuming due to locking and loosening operations

Engineering Contradiction:
Improvecomponent connection strengthVSAvoidassembly process complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent extracts the fastening function from the assembly process by eliminating screws entirely. The connection strength is achieved through precisely engineered geometric interfaces where protrusions fit into recesses, creating a secure fit without requiring additional fastening operations, thereby simplifying the assembly process while maintaining connection integrity.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The chamber components are designed with self-aligning and self-retaining geometric features. When components are brought together, the complementary shapes automatically guide alignment and secure the connection without requiring external fastening actions. The assembly process becomes self-service in nature, where the components themselves provide the connection mechanism.

Inventive Principle:
Principle #25Self-service

3Strength

If screws are used to assemble semiconductor chamber components, then components can be securely mounted, but the assembly time increases due to repeated locking and loosening operations

Engineering Contradiction:
Improvemounting securityVSAvoidassembly productivity
Core Design Contradiction:
StrengthVSProductivity

Solution Approach 1:

The patent removes the time-consuming screw fastening operations by implementing a screwless design. Components are mounted using geometric interlocking features that require simple insertion and positioning actions, dramatically reducing assembly time while maintaining secure mounting through precise geometric constraints and location pinning mechanisms.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The chamber components are pre-designed with complementary geometric features and location pinning elements that prepare the assembly interface in advance. This preliminary design of the geometric interfaces ensures that when components are brought together, they automatically align and secure without requiring time-consuming fastening operations, thereby improving assembly productivity while maintaining mounting security.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS11600517B2Screwless semiconductor processing chambers
Publication Date: 2023.03.07 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US11600517B2 patent drawing
  • US11600517B2 patent drawing
  • US11600517B2 patent drawing

AI summary

In an embodiment, a system includes: a gas distributor assembly configured to dispense gas into a chamber; and a chuck assembly configured to secure a wafer within the chamber, wherein at least one of the gas distributor assembly and the chuck assembly includes: a first portion comprising a convex protrusion, and a second portion comprising a concave opening, wherein the convex protrusion is configured to engage the concave opening.