Scribe Based Bond Pads for Integrated Circuit Testing
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Solution Overview
Problem
The current methods for developing and testing semiconductor devices are costly due to the need for separate silicon variants with bond out pads, which occupy significant silicon area, leading to increased production costs.
Innovation Solution
A method and system for a semiconductor wafer with bond out pads formed in scribe areas between die, allowing for the separation of the wafer into product and test die, where the test circuitry and bond out pads are either destructively removed for product die or maintained for test die, optimizing silicon usage and security.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If bond out pads are provided on each die for development and testing purposes, then software development and testing capability is improved, but silicon area consumption increases and production cost increases
Solution Approach 1:
The wafer is divided into multiple die, with bond out pads strategically placed only in scribe areas between adjacent die pairs. This segmentation allows shared access to bond out functionality without requiring each die to have dedicated pads, thereby reducing total silicon area while maintaining development and testing capability.
Solution Approach 2:
The bond out pads in scribe areas serve multiple functions: they enable software development and testing for adjacent die, and can be selectively destroyed to provide security for product die. This multi-functionality eliminates the need for separate development-specific silicon variants, reducing overall production costs.
2Adaptability or versatility
If bond out pads are provided on each die for development purposes, then development capability is improved, but production cost increases
Solution Approach 1:
Development capability is merged into the standard product wafer structure by placing bond out pads in scribe areas that are common to multiple die. This eliminates the need for separate development silicon variants, allowing a single manufacturing process to produce both product and development-capable die, thereby reducing production costs.
Solution Approach 2:
The state of bond out pads is changed selectively through destructive removal processes applied to specific die after wafer-level processing. This parameter change (from present to destroyed) provides development capability where needed while maintaining security for product die, all within a single manufacturing flow.
3Reliability
If bond out pads are destroyed for product die to enhance security, then security is improved, but test and development capability is lost
Solution Approach 1:
The bond out pad destruction process is applied locally and selectively to specific die based on their intended use. Product die have their adjacent scribe area bond out pads destroyed for security, while test die retain intact bond out pads for development and testing. This local differentiation resolves the contradiction between security and development capability.
Data Source
AI summary
A method and system for utilizing a semiconductor wafer is disclosed. The wafer comprises a plurality of semiconductor die and a plurality of scribe areas interspersed between. The method and system comprises forming bond out pads in the scribe areas such that the bond out pads are disposed on the semiconductor wafer between the plurality of semiconductor die. Additionally, the method and system comprises separating the semiconductor wafer into individual die such that when the semiconductor wafer is separated in a first manner at least one product die is provided. Furthermore, when the semiconductor wafer is separated in a second manner at least one test die is provided.