Semiconductor Scribe Lane Fillet for Laser Dicing Integrity
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Solution Overview
Problem
In semiconductor chip dicing, conductive structures within scribe lanes can protrude or create grooves, leading to issues like shorts, leakage currents, and cracking due to uneven cutting, which complicates subsequent processing steps.
Innovation Solution
A fillet is arranged on the side surfaces of conductive structures within scribe lanes, allowing a laser-cut line to spread along the central portion, ensuring even cutting and preventing structural damage during dicing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a laser is used to cut along the scribe lane to form a cut line, then the semiconductor substrate can be divided into semiconductor chips, but the conductive structures may protrude from the side surface of the semiconductor die causing shorts and leakage current
Solution Approach 1:
The patent applies preliminary action by forming grooves in the scribe lane at predetermined positions before the dicing process. These grooves are specifically positioned to accommodate conductive structures, ensuring that when the laser cuts along the scribe lane, the conductive structures remain properly contained within the semiconductor die rather than protruding. This pre-prepared groove structure prevents electrical shorts and leakage current while maintaining efficient chip separation.
2Ease of manufacture
If the cut line spreads along the side surface of conductive structures, then cutting can be completed, but grooves may form that function as crack seeds and voids in molding processes
Solution Approach 1:
The patent applies local quality by creating grooves with specific geometric characteristics at precise locations within the scribe lane. These grooves have controlled depth, width, and positioning that differ from the surrounding scribe lane structure. The local modification of the scribe lane geometry ensures that the laser cut follows a predetermined path that avoids creating harmful grooves, while still allowing complete separation of the semiconductor substrate into individual chips.
3Measurement precision
If conductive structures are arranged in scribe lanes for testing and alignment, then device functionality can be verified, but uneven cutting may occur during dicing
Solution Approach 1:
The patent introduces grooves as an intermediary structure between the conductive structures and the laser cutting path. These grooves act as a mediator that guides the laser cut along a predetermined trajectory, ensuring uniform cutting depth and path. The grooves provide a physical reference that helps maintain consistent cutting parameters even in the presence of conductive structures, thereby preserving both alignment accuracy and cutting uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents structural damage and ensures consistent cutting, reducing the risk of shorts, leakage, and cracking, facilitating smoother semiconductor chip separation and processing.
Implementation Method 1
A laser may be used to cut along the scribe lane to form a cut line at the scribe lane and the conductive structures
Data Source
AI summary
A semiconductor device includes a semiconductor substrate having a scribe lane defined therein. A plurality of semiconductor chips is formed on an upper surface of the semiconductor substrate. At least one conductive structure is arranged on an upper surface of the semiconductor substrate, within the scribe lane thereof. A fillet is arranged on at least one side surface of the conductive structure. The fillet is configured to induce a cut line which spreads along the scribe lane, through a central portion of the conductive structure.