Scribe-Line Testing Module Layout to Prevent Singulation Debris
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Solution Overview
Problem
The cutting of metallic material within a scribe line during singulation can generate smithereens, potentially causing damage to the equipment chamber, especially when cutting conductive vias with great height.
Innovation Solution
The semiconductor device includes testing modules within the scribe line arranged along orthogonal directions, with conductive elements like traces and vias positioned to avoid the cutting region, preventing damage from smithereens during singulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conductive vias with great height are cut during singulation, then the separation of active regions is achieved, but smithereens are generated causing damage to the equipment chamber
Solution Approach 1:
The patent extracts the testing module from the active region and relocates it to the scribe line area. This separation allows the cutting process to occur in a designated zone away from critical conductive elements, eliminating the generation of harmful smithereens while maintaining manufacturing precision for active region separation.
Solution Approach 2:
The scribe line serves as an intermediary zone between active regions, where testing modules are strategically positioned. This intermediary area acts as a buffer that allows cutting to occur without directly impacting critical conductive vias and traces, thus preventing equipment chamber damage while enabling proper singulation.
2Object-affected harmful factors
If testing modules are placed within the scribe line, then the equipment chamber is protected from smithereens, but the scribe line structure becomes more complex
Solution Approach 1:
The patent merges the testing module placement with the scribe line structure by positioning testing modules within the scribe line area. This integration utilizes the existing scribe line space efficiently, protecting against equipment chamber damage while managing structural complexity through purposeful consolidation of functions in a designated zone.
Data Source
AI summary
A semiconductor device and method for manufacturing the same are provided. The semiconductor device includes a first active region, a second active region, a first testing module, and a second testing module. The second active region is separated by the first active region by a scribe line. The scribe line extends along a first direction. The first testing module abuts the first active region and is disposed within the scribe line. The second testing module abuts the second active region and is disposed within the scribe line. The first testing module and the second testing module are arranged along a second direction substantially orthogonal to the first direction.