Substrate Scrubber Buffer Body Inclination Control
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Solution Overview
Problem
Conventional substrate processing scrubbers face difficulties in effectively removing contaminants and protrusions from the rear surface of substrates due to the inclination of scrubber main bodies caused by repulsive forces during the cleaning process.
Innovation Solution
The substrate processing scrubber design includes a base with scrubber main bodies having a larger attachment surface area than contact surface area, featuring a buffer body with lower rigidity and liquid drain grooves for efficient processing liquid discharge, which helps prevent inclination and ensures effective removal of contaminants.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If scrubber main bodies are separately provided and rotated while pressed against the substrate, then the cleaning process can be performed, but the scrubber main bodies become inclined against the substrate due to repulsive force, reducing cleaning effectiveness
Solution Approach 1:
The scrubber main bodies are divided into multiple independent units (first, second, third, and fourth scrubber main bodies) arranged circumferentially around the base. Each scrubber main body can be independently positioned and functions autonomously to remove contaminants from different regions of the substrate, allowing the system to maintain effective cleaning performance while managing the inclination issue through distributed contact points.
Solution Approach 2:
Each scrubber main body is equipped with a processing liquid supply opening that supplies processing liquid locally to its contact region with the substrate. This localized liquid supply enhances the cleaning effectiveness at each specific contact point, compensating for the inclination of individual scrubber main bodies by ensuring adequate lubrication and contaminant removal capability at each local region.
2Area of stationary object
If multiple scrubber main bodies are used to clean the substrate, then coverage area increases, but the complexity of the device structure increases
Solution Approach 1:
Multiple scrubber main bodies are integrated onto a single base structure that rotates as one unit. The base serves as a common platform that holds and synchronizes the movement of all scrubber main bodies, reducing the overall system complexity compared to having multiple independent rotating scrubbers. The processing liquid supply system is also merged into the base, with supply openings positioned to serve specific scrubber main bodies.
Solution Approach 2:
The base structure serves multiple functions: it holds the scrubber main bodies, provides rotational movement, supplies processing liquid through integrated openings, and maintains the spatial arrangement of scrubber main bodies. This multi-functionality reduces the need for separate components and simplifies the overall device structure while achieving comprehensive cleaning coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for stable contact and efficient removal of contaminants from the substrate surface, preventing scrubber main body inclination and enhancing the effectiveness of the cleaning process.
Implementation Method 1
a buffer body provided between the base body and each of the scrubber main bodies. Further, the base body may be made of a rigid material and the buffer body may be made of an elastic material having lower rigidity than that of the scrubber main bodies
Implementation Method 2
by pressing and rotating a substrate processing scrubber against the rear surface of the substrate, such a cleaning process or a polishing process is performed on the rear surface of the substrate. Thus, the removal target such as the contaminants or the protrusions is removed from the rear surface of the substrate
Data Source
AI summary
A removal target can be effectively removed from a substrate. In a substrate processing apparatus 1 and a substrate processing method by using a substrate processing scrubber 29 of removing the removal target from the substrate 5, the substrate processing scrubber 29 includes a base 31 connected to a rotation shaft 28; scrubber main bodies 32 provided at the base 31 and arranged at a regular distance in a rotational direction of the base 31; and a processing liquid supply opening 36 formed at the base 31 and configured to supply a processing liquid to the scrubber main bodies 32. Further, an area of an attachment surface of each of the scrubber main bodies 32 to be attached to the base 31 is larger than an area of a contact surface of each of the scrubber main bodies 32 to be brought into contact with the substrate 5.