Semiconductor Scrubber Tray Structure for Bubble-Enhanced Gas Absorption
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Solution Overview
Problem
Existing scrubbers for semiconductor apparatuses face inefficiencies in the contact area between scrubbing solutions and gases, limiting the effectiveness of pollutant removal processes.
Innovation Solution
The scrubber design includes an absorption tower with multiple trays and shower heads that generate bubbles in the scrubbing solution, increasing the contact area with the gas mixture, and utilizes a system of interconnected scrubbing spaces to enhance the dissolution of harmful gases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a filler is installed to increase contact area between scrubbing solution and exhaust gas, then scrubbing efficiency is improved, but device complexity increases
Solution Approach 1:
The patent employs a filler composed of porous materials with high surface area to volume ratio, which dramatically increases the contact area between the scrubbing solution and exhaust gas. The porous structure provides numerous internal surfaces for mass transfer, enhancing scrubbing efficiency without requiring excessively large equipment dimensions.
Solution Approach 2:
The absorption tower is divided into multiple sections with fillers arranged in specific patterns, creating segmented contact zones. This segmentation allows the exhaust gas to flow through multiple stages of contact with the scrubbing solution, improving overall scrubbing efficiency while maintaining manageable device complexity through modular design.
2Area of stationary object
If a spray nozzle is installed to supply water with small particles, then contact area between scrubbing solution and exhaust gas is increased, but device complexity increases
Solution Approach 1:
The patent utilizes hydraulic principles through the spray nozzle system that atomizes the scrubbing solution into fine droplets. This pneumatic-hydraulic mechanism creates a large surface area of liquid dispersion that contacts the exhaust gas, significantly enhancing mass transfer efficiency without requiring complex mechanical moving parts.
3Productivity
If multiple scrubbing stages are added to improve pollutant removal efficiency, then scrubbing efficiency is improved, but device complexity increases
Solution Approach 1:
The patent implements a nested structure where multiple scrubbing stages are arranged concentrically or in vertically stacked configurations within the absorption tower. Each stage contains fillers and spray nozzles, with exhaust gas flowing through successive stages. This nesting approach achieves multi-stage scrubbing efficiency while compacting the overall device footprint and reducing structural complexity compared to separate sequential units.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves scrubbing efficiency by increasing the contact area between the scrubbing solution and gas, effectively dissolving harmful gases and reducing environmental pollution by recycling the scrubbing solution.
Implementation Method 1
the gas mixture passes through the first tray hole and rises in the second direction... the gas mixture passing through the first tray hole and rising in the second direction to generate bubbles
Implementation Method 2
at a surface where the bubbles come into contact with the first scrubbing solution, at least a portion of the first gas is dissolved into the first scrubbing solution
Data Source
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AI summary
The present invention relates to a scrubber for semiconductor apparatus that can effectively scrub a gas generated after performing a semiconductor process. The scrubber for semiconductor apparatus comprises an absorption tower separating the gas mixture into a first gas and a second gas, a housing defining a first scrubbing space in the absorption tower where a first scrubbing process is performed, a first tray connected to a first inner side wall of the housing, and extending a first direction intersecting the first inner side wall, a first tray hole penetrating the first tray in a second direction intersecting the first direction, and through which the gas mixture passes, and a solution supply nozzle providing a first scrubbing solution for performing the first scrubbing process to an upper surface of the first tray, wherein the gas mixture passes through the first tray hole and rises in the second direction.