Seal Member Gap Management in Electronic Device Cooling
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Solution Overview
Problem
In electronic devices with multiple semiconductor elements, heated cooling air often flows back into the enclosure due to gaps between the radiator and vent holes, leading to increased internal temperatures and reduced cooling efficiency.
Innovation Solution
The use of seal members, such as side and top seal plates, to cover the gaps between the radiator and vent holes, preventing the backflow of heated air and enhancing cooling efficiency by ensuring all heated air is discharged outside the enclosure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the cooling fin and radiator are arranged as adjacent to the vent holes as possible, then the discharge of heated cooling air is improved, but the gap between the side wall and the radiator cannot be completely eliminated due to assembly operability and fixation member limitations
Solution Approach 1:
A seal member is introduced as an intermediary component between the radiator and the enclosure side wall. This seal member fills the gap that cannot be eliminated due to assembly constraints, preventing heated cooling air from flowing back into the enclosure through the gap while maintaining the radiator's position adjacent to the vent holes for efficient heat discharge.
2Reliability
If the cooling fan or radiator are enlarged to maintain cooling performance, then the cooling performance requirement is met, but the device size and power consumption increase
Solution Approach 1:
The seal member converts the harmful effect of the gap (allowing heated air to flow back and reduce cooling efficiency) into a beneficial sealing function. By preventing the backflow of heated air, the system maintains high cooling efficiency with the existing fan and radiator size, avoiding the need to enlarge these components and thereby reducing power consumption and device size.
3Object-affected harmful factors
If the gap between the radiator and side wall is reduced, then the flow back of heated cooling air is reduced, but the assembly operability and fixation member arrangement are compromised
Solution Approach 1:
The seal member serves as a mediator that addresses the gap issue without requiring the radiator to be positioned extremely close to the side wall. It fills the necessary gap for assembly operability while preventing heated air from flowing back into the enclosure, thus resolving the contradiction between gap reduction and assembly ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the temperature rise within the enclosure, improves cooling performance, and allows for smaller, less power-intensive cooling units, while minimizing the impact on non-forced-cooled semiconductor elements.
Implementation Method 1
The other end of the heat pipe is thermally connected to the radiator such that the heat of the heat generator (CPU) is transmitted to the heat pipe via the heat receiver, and further transmitted to the radiator.
Implementation Method 2
Heat exchange is performed between a plurality of fins of the radiator and cooling air generated by the cooling fan.
Implementation Method 3
The heat receiver at one end of the heat pipe is thermally connected to the heat generator (CPU).
Data Source
AI summary
An electronic device is provided with an enclosure having a side wall in which vent holes are formed, a heat generator stored in the enclosure, a radiator disposed adjacent to the vent holes, a heat receiver thermally connected to the heat generator, a heat transmission member having one end thermally connected to the heat receiver and the other end thermally connected to the radiator, a fan disposed adjacent to the radiator to generate cooling air toward the radiator, and a seal member that seals a gap formed between the radiator and the side wall having the vent holes formed therein.