Semiconductor Die Seal Ring Layout With Buffer-Zone Routing
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Solution Overview
Problem
Current semiconductor technology faces challenges with the double seal ring structure, which while effective in preventing cracking, limits the routing area of the semiconductor die, leading to electrical issues such as crosstalk, signal propagation delay, and electromagnetic interference in high-speed and multi-functional applications.
Innovation Solution
The semiconductor structure incorporates a buffer zone within the seal ring region, separating the electronic circuit from the seal ring, and includes conductive routing in this buffer zone, which is electrically connected to the electronic circuit, thereby enhancing electrical performance and reducing the routing area requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a double seal ring structure is used to prevent cracking, then the reliability of the semiconductor die is improved, but the routing area is reduced
Solution Approach 1:
The invention divides the seal ring structure into two separate components: an inner seal ring and an outer seal ring, with the inner seal ring positioned closer to the circuit region and the outer seal ring positioned closer to the scribe line. This segmentation allows the seal rings to be distributed across different areas, reducing their combined impact on the routing area while maintaining crack prevention functionality through the distributed barrier effect.
Solution Approach 2:
The invention introduces a buffer zone as an intermediary region between the inner seal ring and the outer seal ring. This buffer zone serves as a mediator that provides additional routing space while maintaining the protective function of the seal rings. The buffer zone acts as a transition area that allows signal routing to occur without directly interfering with the seal ring structures, thus resolving the conflict between protection and routing requirements.
2Reliability
If the seal ring occupies more area to prevent cracks, then the reliability is improved, but the routing flexibility is reduced
Solution Approach 1:
By segmenting the seal ring into inner and outer components with a buffer zone between them, the invention creates multiple distinct regions that can be independently utilized for routing purposes. This segmentation provides routing flexibility by offering alternative paths through the buffer zone and around the distributed seal ring structures, rather than having a single large continuous seal ring that would block routing options.
Solution Approach 2:
The invention utilizes the radial dimension of the semiconductor die by positioning seal rings at different radial distances from the center. The inner seal ring is positioned at a first radial distance while the outer seal ring is positioned at a second radial distance, creating a multi-dimensional seal ring configuration. This dimensional distribution allows routing to occur in the intermediate buffer zone without compromising the circumferential protection provided by the seal rings.
Data Source
AI summary
A semiconductor structure and a semiconductor die are provided. The semiconductor structure includes a semiconductor substrate, an electronic circuit, a first seal ring, a buffer zone and a conductive routing. The semiconductor substrate has a circuit region and a seal ring region surrounding the circuit region. The electronic circuit is disposed on the semiconductor substrate in the circuit region. The first seal ring is disposed on the semiconductor substrate in the seal ring region and surrounding the circuit region. The buffer zone is located in the seal ring region and interposed between the circuit region and the first seal ring. The first seal ring is separated from the circuit region by the buffer zone. The conductive routing is disposed on the semiconductor substrate in the buffer zone. The conductive routing is electrically connected to the electronic circuit.