Semiconductor Seal Ring Molding for Contamination Control
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Solution Overview
Problem
The manufacturing of miniaturized semiconductor devices is complex and prone to issues like contamination, poor electrical interconnection, and high yield loss due to the complexity of manufacturing operations, which increases costs and material wastage.
Innovation Solution
A semiconductor device design that includes a substrate with a seal ring structure and integrated circuit structure, where the seal ring structure is covered by a molding material to prevent contamination and damage, and a dummy bar structure is integrated to enhance manufacturing efficiency and reduce costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the semiconductor device is miniaturized to reduce size, then the packaging cost is reduced and manufacturing is simplified, but the complexity of manufacturing operations increases leading to contamination, poor electrical interconnection, and high yield loss
Solution Approach 1:
The device is divided into distinct functional regions: a circuit region containing active circuit elements and a seal ring region surrounding it. This segmentation allows independent optimization of each region - the circuit region for electrical functionality and the seal ring region for mechanical protection and manufacturing stability, thereby reducing overall manufacturing complexity despite miniaturization
Solution Approach 2:
A seal ring structure is formed in advance around the circuit region before final device assembly and packaging operations. This preliminary protective structure prevents contamination and mechanical damage during subsequent manufacturing steps, addressing the contamination and yield loss issues that arise from increased manufacturing complexity in miniaturized devices
2Adaptability or versatility
If more different components with different materials are involved to enhance functionality, then the device functionality is improved, but the complexity of manufacturing operations is increased
Solution Approach 1:
The seal ring structure serves multiple functions simultaneously: it provides mechanical support, electrical isolation, contamination protection, and structural stability during manufacturing operations. This multi-functionality reduces the need for separate components, thereby maintaining device functionality while reducing manufacturing operation complexity
Solution Approach 2:
The seal ring is configured to provide uniform mechanical and electrical properties around the entire circuit region. This equipotential design ensures consistent performance across the device regardless of the number or type of components in the circuit region, simplifying manufacturing operations while maintaining enhanced functionality
Data Source
AI summary
A semiconductor device includes a substrate defined with a seal ring region and a circuit region, the substrate includes a seal ring structure and an integrated circuit structure, the seal ring structure is disposed in the seal ring region and includes a plurality of stacked conductive layers interconnected by a plurality of via layers, the integrated circuit structure is disposed in the circuit region and includes an active or a passive device; a metal pad disposed over the seal ring region and contacted with the seal ring structure; a passivation layer disposed over the substrate and covering the metal pad; a polymeric layer disposed over the passivation layer and the circuit region; and a molding disposed over the passivation layer and the polymeric layer, wherein the seal ring structure is covered by the molding.