Seal Ring Layout for Shorter Die-to-Die Talking Paths
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Solution Overview
Problem
The integration density and performance of semiconductor packages, particularly in 3DICs, are limited by the length and complexity of interconnects between stacked chips, which hinder efficient communication and increase packaging size.
Innovation Solution
The solution involves optimizing the semiconductor package design by narrowing or removing seal rings between bonding structures and conductive features, allowing for closer proximity of bonding structures and reduced die-to-die talking paths, thereby shortening communication paths and improving package performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If seal rings are maintained at standard width between bonding structures, then sealing and protection functions are ensured, but die-to-die talking path length increases and communication efficiency decreases
Solution Approach 1:
The seal ring structure is modified to have different widths in different regions: a first width in the first region and a second width in the second region, where the second width is less than the first width. This local differentiation allows the seal ring to maintain adequate sealing function in critical areas while reducing the overall die-to-die talking path length in regions where sealing requirements are lower, thus resolving the contradiction between sealing reliability and communication efficiency.
2Productivity
If seal rings are narrowed or removed to shorten talking paths, then communication efficiency improves, but sealing and protection functions may be compromised
Solution Approach 1:
The seal ring is designed with spatially varying width characteristics, maintaining greater width (and thus better sealing) in regions where protection is critical while reducing width in regions where communication path length is the primary concern. This localized optimization allows the system to achieve improved communication efficiency without fully compromising sealing functionality.
Solution Approach 2:
The seal ring is effectively segmented into different functional regions with different width characteristics. The first region maintains standard width for adequate sealing, while the second region has reduced width to minimize talking path length. This segmentation allows the seal ring to simultaneously fulfill both sealing and space-saving requirements in different locations.
3Area of stationary object
If bonding structures are placed closer together to reduce package size, then integration density improves, but seal ring space is reduced and manufacturing precision requirements increase
Solution Approach 1:
The seal ring width is locally reduced in specific regions to accommodate closer bonding structures, while maintaining adequate width in other regions. This allows the package to achieve higher integration density with smaller overall area while the varied seal ring design provides tolerance to alignment variations, reducing the stringency of manufacturing precision requirements.
Data Source
AI summary
A semiconductor package includes a first die. The first die has a first side and a second side different from the first side and includes a first seal ring. The first seal ring includes a first portion at the first side and a second portion at the second side, and a width of the first portion is smaller than a width of the second portion.