Electronic Assembly Seal Support for PCB Press-Fit Cooling Gaps
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Solution Overview
Problem
Existing electronic arrangements face challenges in providing adequate mechanical support during the assembly of printed circuit boards onto pins, particularly due to the absence of direct support in configurations with cooling regions, leading to potential damage and inefficiencies in the pressing process.
Innovation Solution
An electronic arrangement featuring a base plate, electronic component with pins, a seal arrangement with press-in domes, and a holding plate that provides indirect mechanical support through press-in domes to absorb and distribute the press-on force, ensuring a precise and reliable press connection between the printed circuit board and pins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling region is introduced between the electronic component and base plate, then cooling functionality is improved, but mechanical support during pressing-on deteriorates
Solution Approach 1:
The seal carrier acts as an intermediary element between the electronic component and the base plate. It provides the missing mechanical support function that cannot be directly provided due to the cooling region gap, while maintaining the cooling functionality. The press-in domes on the seal carrier transmit the pressing force to the electronic component, enabling reliable assembly despite the cooling region.
2Reliability
If direct support is provided during pressing-on, then assembly reliability is improved, but the cooling region functionality deteriorates
Solution Approach 1:
The support function is segmented from the base plate and transferred to the seal carrier. The seal carrier with its press-in domes provides localized support points that enable reliable pressing-on, while the overall cooling region between the electronic component and base plate remains intact and functional.
3Manufacturing precision
If the electronic component is directly supported during pressing-on, then pressing precision is improved, but the seal arrangement complexity increases
Solution Approach 1:
The seal carrier is designed to perform multiple functions: it provides mechanical support through press-in domes, ensures sealing through the seal, and enables precise pressing-on. This multi-functionality integrates the support function into the existing seal arrangement without requiring separate support structures, thus maintaining simplicity while achieving precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a simple, cost-effective, and precise assembly process that prevents damage by distributing mechanical loads effectively, ensuring a durable and reproducible press connection with minimal deviations, while maintaining optimal sealing and cooling functionality.
Implementation Method 1
the press-in domes support the electronic component here in order to absorb a press-on force when the printed circuit board is pressed onto the pins
Implementation Method 2
The seal may be an elastomer seal, e.g. an O-ring seal. The seal is preferably at least partly received in the seal carrier
Implementation Method 3
The cooling region, in particular with coolant, may be provided in order to enable cooling of the electronic component
Data Source
AI summary
The present invention relates to an electronic assembly (1) comprising: a base plate (2); an electronic component (3) having a plurality of pins (30) which each extend parallel to a press-in axis (4); a printed circuit board (5) which is pressed onto the pins (30) along the press-in axis (4); a cooling region (6) which is formed between the electronic component (3) and the base plate (2); and a sealing arrangement (7) which is located between the base plate (2) and the electronic component (3) and is designed to seal the cooling region (6), wherein the sealing arrangement (7) has a seal support (71) and at least one seal (72), the seal support (71) has a plurality of press-in domes (75) projecting parallel to the press-in axis (4), and the electronic component (3) is supported by means of the press-in domes (75) of the seal support (71) in order to absorb a press-on force (40) when the printed circuit board (5) is pressed onto the pins (30).