Sealable Liquid Cooling Module With Conformal Heat Transfer Surface
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Solution Overview
Problem
Current cooling methods for electronic components in data processing centers face inefficiencies due to high thermal resistance and energy consumption, particularly when using air as a transfer medium, which limits server density and increases costs.
Innovation Solution
A sealable module with a housing and heat transfer device featuring a conduction surface that conforms to the electronic component, allowing for efficient heat transfer between a first cooling liquid and a second cooling liquid, reducing thermal resistance and eliminating the need for vapor-cycle refrigeration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If air is used as a transfer medium for heat, then the system complexity is reduced, but the heat transfer efficiency deteriorates due to high thermal resistance
Solution Approach 1:
The patent replaces air cooling with liquid cooling systems. A coolant liquid circulates through channels in contact with or immersed in the electronic component, providing superior heat transfer efficiency due to liquid's higher thermal conductivity compared to air, while maintaining manageable system complexity through standardized liquid cooling architectures.
Solution Approach 2:
The patent changes the physical state and properties of the transfer medium from gas (air) to liquid (coolant). This parameter change fundamentally improves heat transfer capability by utilizing the liquid phase's superior thermal conductivity and heat capacity, directly resolving the thermal resistance issue while keeping the system design feasible.
2Temperature
If the temperature difference is increased to improve heat transfer rate, then the heat transfer efficiency improves, but the energy consumption increases due to additional cooling requirements
Solution Approach 1:
The patent implements continuous circulation of the coolant liquid through closed-loop channels, maintaining constant heat transfer action without interruption. This continuous flow ensures steady heat removal efficiency while optimizing energy consumption by eliminating the need for periodic or intensive cooling interventions that would require additional energy input.
Solution Approach 2:
The patent introduces a coolant liquid as an intermediary substance between the heat-generating electronic component and the final heat sink. This intermediary medium efficiently transports thermal energy through its flow, reducing the need for extreme temperature differences and the associated energy consumption for maintaining such gradients.
3Productivity
If server density is increased to improve productivity, then the output per unit area improves, but the thermal resistance increases due to reduced air flow
Solution Approach 1:
The patent replaces air-based cooling with liquid-based cooling systems that can handle higher heat densities. The liquid coolant's superior thermal properties enable effective heat removal from densely packed servers, allowing increased server density without the thermal resistance problems that plague air-cooled high-density configurations.
Solution Approach 2:
The patent transitions from two-dimensional air flow cooling to three-dimensional liquid immersion or channel-based cooling. This dimensional change allows heat to be extracted from multiple directions and surfaces simultaneously, enabling effective cooling of high-density server configurations where traditional air flow paths become insufficient.
4Temperature
If vapor-cycle refrigeration is used to cool the system, then the temperature control improves, but the device complexity and cost increase
Solution Approach 1:
The patent extracts and eliminates the vapor-cycle refrigeration system from the cooling architecture. By using direct liquid cooling through simplified channels in contact with electronic components, the system achieves effective temperature control without the complex compressors, condensers, and expansion devices required by vapor-cycle systems, thereby reducing both device complexity and cost.
Solution Approach 2:
The patent replaces the mechanical vapor-cycle refrigeration system with a simpler liquid circulation-based cooling system. This substitution eliminates complex mechanical components (compressors, valves, heat exchangers) in favor of a more straightforward liquid flow system that achieves comparable or superior temperature control with reduced complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat transfer efficiency, reduces energy consumption, and increases server density by maintaining the cooling liquid in a liquid state, while minimizing complexity and cost, effectively managing heat within data processing centers.
Implementation Method 1
the conduction surface separating the volume and the channel to allow conduction of heat between the volume and the channel through the conduction surface
Implementation Method 2
Cooling the electronic components using a liquid that is brought into contact with the electronic components can be used to increase server density, reduce cooling costs or both
Data Source
AI summary
A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.