Hermetic Electronic Assembly for Non-Dielectric Immersion Cooling
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Solution Overview
Problem
Conventional dielectric fluid-based immersion cooling systems for electronic components suffer from low heat transfer efficiency, corrosion, and high maintenance costs due to limited efficacy life cycles, necessitating a more effective cooling solution.
Innovation Solution
A hermetic sealed electronic assembly package submerged in a non-dielectric fluid, such as water, within a rack-mounted immersion reservoir, protected by a hermetic sealed bag with thermally-conductive fins and phase-change materials, coupled with a dual cooling loop system using a liquid-to-liquid heat exchanger for efficient heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If dielectric cooling liquids are used for immersion cooling, then electronic components can be cooled effectively, but heat transfer efficiency is reduced due to fluid viscosity
Solution Approach 1:
A hermetic sealed bag acts as an intermediary barrier between the electronic components and the non-dielectric cooling fluid, enabling the use of water or other non-dielectric fluids with superior heat transfer properties while protecting the electronics from direct fluid exposure
Solution Approach 2:
The invention changes the fluid parameter from dielectric (oil-based) to non-dielectric (water-based), fundamentally altering the heat transfer characteristics by using a fluid with lower viscosity and higher thermal conductivity, while the hermetic seal enables this parameter change without compromising electronic safety
2Temperature
If dielectric cooling liquids are used for immersion cooling, then electronic components can be cooled, but corrosion and breakdown of electrical contacts occur after extended exposure
Solution Approach 1:
The hermetic sealed bag serves as a protective intermediary that completely isolates electronic components from direct contact with cooling fluids, eliminating the corrosion mechanism while preserving the cooling function through thermal conduction through the bag material
Solution Approach 2:
The hermetic seal creates an inert protective environment around the electronic components, preventing any chemical interaction between the cooling fluid and electronic contacts, thereby eliminating corrosion regardless of the fluid type used
3Temperature
If dielectric cooling liquids are used in large scale datacenters, then cooling can be provided, but maintenance costs increase due to limited efficacy life cycles requiring complete replacement every 5-10 years
Solution Approach 1:
The hermetic sealed bag enables the use of non-dielectric fluids like water that do not degrade over time, eliminating the need for periodic fluid replacement and significantly reducing maintenance costs while improving heat transfer efficiency
Solution Approach 2:
The invention inverts the traditional approach by making the fluid reusable indefinitely (non-dielectric water-based fluids) while the hermetic seal becomes the replaceable component, eliminating the need to discard expensive dielectric fluids every 5-10 years
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat transfer efficiency, reduces corrosion, and lowers maintenance costs by utilizing a non-dielectric fluid protected by a hermetic seal and a dual cooling loop system, ensuring reliable operation of electronic components.
Implementation Method 1
maintain thermal contact between the heat generating electronic components and the dielectric cooling liquid
Implementation Method 2
incorporate a heat managing substance (e.g. a phase-changing material, PCM) that may be coupled to the fin structures
Implementation Method 3
coupled with a dual cooling loop system using a liquid-to-liquid heat exchanger for efficient heat management
Data Source
AI summary
The disclosed systems, structures, and methods are directed to providing a rack-mounted fluid immersion cooling (IC) configuration. The rack-mounted fluid IC configuration comprises a rack-mounted immersion reservoir containing a volume of thermally cooled non-dielectric fluid and at least one electronic processing assembly comprising one or more electronic processing components. The at least one electronic processing assembly being encased within a hermetic sealed bag configured to provide a water- and air-tight seal of the at least one electronic processing assembly to shield against the direct exposure of the electronic processing components to fluids. The at least one hermetic sealed electronic processing assembly is submerged within the volume of thermally cooled fluid contained by the rack-mounted immersion reservoir.