Sealed Body Metal Layer Laser Energy Control
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Solution Overview
Problem
The existing method of sealing semiconductor devices using low-melting-point glass frits faces issues with airtightness and yield due to excess energy application during laser light irradiation, which can lead to reduced adhesion and deformation of the sealing member and wiring layer.
Innovation Solution
A sealed body structure is implemented where a metal layer is selectively provided between the wiring layer and the sealing layer, acting as a semi-transmissive film to control energy application during laser light irradiation, preventing excess energy exposure and ensuring uniform melting of glass frits, while also preventing peeling or deformation of the metal layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser light is irradiated to melt glass frits in the sealing member, then the glass frits are melted and substrates are welded, but excess energy causes reduced adhesion and deformation of the wiring layer
Solution Approach 1:
The patent applies local quality by making the sealing member have different optical properties in different regions. Specifically, the sealing member is designed to have different laser light absorption characteristics in the overlap region (where sealing member and wiring layer overlap) versus non-overlap regions. This allows selective energy absorption: the non-overlap regions absorb sufficient laser energy to melt glass frits effectively, while the overlap region absorbs less energy to prevent wiring layer deformation and maintain adhesion.
Solution Approach 2:
The patent introduces an intermediary approach by controlling the optical properties of the sealing member itself to mediate the laser energy distribution. Rather than using an external component like a reflective mask, the sealing member's own material composition or structure is modified to act as the mediator that regulates energy transmission, preventing excess energy from reaching the wiring layer in overlap regions.
2Reliability
If a reflective mask is provided outside the counter substrate to reduce laser energy in the overlap region, then excess energy application is suppressed, but the metal film may peel or deform causing contamination and yield reduction
Solution Approach 1:
The patent extracts the harmful reflective mask component from the external environment and eliminates its associated problems (peeling, deformation, contamination). Instead of using a separate metal film mask outside the substrate, the energy regulation function is integrated into the sealing member itself, which is already part of the sealed structure and bonded to the substrate, thus avoiding the peeling and contamination issues.
Solution Approach 2:
The patent applies nesting by integrating the energy regulation function within the sealing member, which is already nested within the sealed body structure. The sealing member contains the optical property modifications needed to regulate laser energy, embedding the protective function within the existing layered structure rather than adding external components.
3Manufacturing precision
If laser light energy is increased to ensure complete melting of glass frits, then sealing effectiveness is improved, but the wiring layer may deform or disconnect
Solution Approach 1:
The patent applies local quality by creating spatial variation in laser energy absorption within the sealing member. Different regions of the sealing member have different optical properties: regions away from the wiring layer have higher absorption to ensure complete glass frit melting, while the region overlapping with the wiring layer has lower absorption to protect the wiring layer from excessive energy that would cause deformation or disconnection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the airtightness and yield of the sealed body by ensuring accurate and uniform melting of glass frits, maintaining high adhesion, and preventing deformation or disconnection of the wiring layer, thus improving the reliability and manufacturing efficiency of semiconductor devices.
Implementation Method 1
In a laser light irradiation step, the metal layer functions as a laser light semi-transmissive film and suppresses application of excess energy to a sealing member in a region overlapping with the wiring layer
Implementation Method 2
the glass substrate is overlapped with a counter substrate; the sealing member is irradiated with laser light to melt the glass fits contained in the sealing member, so that a sealing layer is formed
Data Source
AI summary
A sealed body which is sealed with low-melting-point glass and has high airtightness is provided. In the sealed body, at least a wiring layer is provided between two facing substrates, the two substrates are bonded together with the use of a sealing layer containing glass frits as a material, and a metal layer is selectively provided in a region where the wiring layer and the sealing layer overlap. In a laser light irradiation step, the metal layer functions as a laser light reflecting film and suppresses application of excess energy to a sealing member in a region overlapping with the wiring layer.