Sealed Electronics Box With External Duct Cooling for In-Flight Entertainment

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Solution Overview

Problem

Conventional electronics boxes in commercial passenger vehicles face challenges with complex structures that make maintenance and upgrades difficult, are prone to dust and moisture intrusion, and limit installation options due to liquid risk, necessitating costly waterproofing.

Innovation Solution

A modular design with separate processor and power supply modules, a sealed structure, and an external cooling system that uses a duct cover and heat dissipation elements to prevent contamination and optimize component placement for efficient cooling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of repair

If conventional electronics boxes use integrated structures, then manufacturing is simpler, but maintenance and upgrades become difficult

Engineering Contradiction:

Improvemaintenance and upgradesVSAvoidstructure

Core Design Contradiction:

Ease of repairVSDevice complexity

Solution Approach 1:

The electronics box is divided into separate functional modules: processor module, power supply module, and cooling structure. Each module can be independently accessed, maintained, and upgraded without disassembling the entire unit, resolving the contradiction between structural simplicity and ease of repair.

Inventive Principle:

Principle #1Segmentation

2Reliability

If electronics boxes are not sealed, then manufacturing is easier, but dust and moisture intrusion occurs

Engineering Contradiction:

Improvecontamination resistanceVSAvoidsealed structure

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The sealed enclosure is segmented into multiple detachable modules connected through sealed interfaces. This allows the enclosure to maintain dust and moisture resistance while enabling individual module access for maintenance, balancing reliability with ease of manufacture.

Inventive Principle:

Principle #1Segmentation

3Temperature

If cooling structures are integrated inside the sealed enclosure, then cooling efficiency is improved, but liquid intrusion risk increases

Engineering Contradiction:

Improvecooling efficiencyVSAvoidliquid intrusion risk

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The cooling structure is extracted from the sealed enclosure and positioned externally. The processor module is thermally connected to the external cooling structure through thermal interfaces, allowing efficient heat dissipation while keeping the sealed enclosure liquid-tight, thus resolving the contradiction between cooling efficiency and liquid intrusion risk.

Inventive Principle:

Principle #2Taking out (Extraction)

4Reliability

If waterproofing treatments are applied to protect against liquid, then reliability is improved, but cost increases

Engineering Contradiction:

Improveliquid protectionVSAvoidcost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

By extracting the cooling structure from the sealed enclosure, the patent eliminates the need for expensive waterproofing treatments on internal cooling components. The sealed enclosure only needs to protect electronic components, while the external cooling structure is inherently exposed to the environment, reducing manufacturing costs while maintaining reliability.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Facilitates easy maintenance, reduces contamination risk, and minimizes installation space, enhancing passenger experience by allowing flexible installation and reducing the need for additional protective treatments.

Implementation Method 1

a fan introducing air from outside into the cooling structure, the air creating an air passage that is external to the sealed enclosure and extending along the surface of the sealed enclosure

Methodology Applied

Scientific EffectForced Convection: Forced Convection

Implementation Method 2

one or more heat dissipation elements disposed in the air passage and configured to dissipate heat generated by the electronic components

Methodology Applied

Scientific EffectThermal Conduction: Conduction (thermal)

Implementation Method 3

heat dissipation elements disposed in the air passage and configured to dissipate heat generated by the electronic components

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS12432874B2Electronics box for in-flight entertainment system

Publication Date: 2025.09.30 PANASONIC AVIONICS CORP

AI summary

This patent document describes techniques are related to an apparatus for an electronics box for an in-flight entertainment system. The electronics box comprises: a sealed enclosure including electronic components for the in-flight entertainment system disposed in a commercial passenger vehicle; and a cooling structure disposed on a surface of the sealed enclosure and includes: a fan introducing air from outside into the cooling structure, the air creating an air passage that is external to the sealed enclosure and extending along the surface of the sealed enclosure; one or more heat dissipation elements disposed in the air passage and configured to dissipate heat generated by the electronic components; and a duct cover covering the fan and the one or more heat dissipation elements and having an air inlet through which the air enters into the cooling structure.