Sealed Capacitor Element Structure for Flatness and Warp Control
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Solution Overview
Problem
Conventional capacitor arrays exhibit significant differences in characteristics, such as thermal characteristics and stiffness, between the two main surfaces due to inconsistent through hole sizes, leading to warping and deterioration in flatness.
Innovation Solution
A capacitor element design with a sealing layer composed of insulating material covering both main surfaces, featuring through portions with specific width variations to balance the size and characteristics between the surfaces, ensuring uniformity and reducing warping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through holes are formed by laser processing or conventional methods, then connection between anode layer and outer electrode layer is achieved, but the diameter of through holes becomes inconsistent between the two main surfaces, causing significant differences in characteristics (thermal characteristics and stiffness) and leading to warping
Solution Approach 1:
The through portions are designed with asymmetric width variations: the width at the first main surface side is larger than the width at the second main surface side. This asymmetric configuration compensates for the inherent inconsistencies in conventional through hole formation processes, ensuring that the effective connection area is balanced between the two surfaces while maintaining reliable electrical connection.
Solution Approach 2:
The patent applies different width characteristics to different locations of the through portions. By making the width at the first main surface side larger and the width at the second main surface side smaller, the design creates local quality variations that balance the overall characteristics between the two surfaces, preventing warping while ensuring connection reliability.
2Reliability
If through holes with larger diameter are formed to ensure connection, then connection reliability improves, but the size difference between the two main surfaces increases, causing greater warping and deterioration in flatness
Solution Approach 1:
The asymmetric width design of through portions allows the connection reliability to be maintained through sufficient width at both surfaces, while the deliberate width reduction at the second main surface side prevents excessive size difference that would cause warping. This balances connection needs with flatness requirements.
3Shape
If through holes with smaller diameter are formed to maintain flatness, then warping is reduced, but connection reliability deteriorates
Solution Approach 1:
The asymmetric design ensures that the width at the first main surface side is larger, providing sufficient connection area for reliable electrical connection, while the width at the second main surface side is smaller to maintain overall flatness. This asymmetric distribution optimizes both connection reliability and flatness simultaneously.
Data Source
AI summary
A capacitor element including: a planar capacitor layer; and a sealing layer that includes a first insulation portion covering a first main surface of the capacitor layer and a second insulation portion covering a second main surface of the capacitor layer, the capacitor layer includes a plurality of through portions passing therethrough, the plurality of through portions include one or more first through portions and one or more second through portions, a width of an end portion of the first through portions on a first insulation portion side is larger than a width of an end portion of the first through portions on a second insulation portion side, and a width of an end portion of the second through portions on the first insulation portion side is smaller than a width of an end portion of the second through portions on the second insulation portion side.