Sealed Casing Thermal Conduction for Slot Machine Security
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Solution Overview
Problem
High-performance PC systems in slot machines face challenges with heat dissipation due to high heat generation, reliability issues with small fans, and security concerns from ventilation holes required for cooling, which compromise the integrity and security of the system.
Innovation Solution
The electronic assembly features a casing with thermally conductive walls that directly couple heat-generating components to the casing, eliminating the need for ventilation holes by using conductive blocks and thermal agents for efficient heat transfer, and a sealed design with a large, reliable fan for external air flow through cooling fins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heat sink/fan assemblies are used on hot devices, then heat is removed from devices into surrounding air, but fans are low reliability items and heat should ideally be removed directly to outside the enclosure
Solution Approach 1:
The invention extracts the fan component from the internal enclosure and relocates it to the external environment. The fan is now positioned outside the sealed logic box, drawing air through external cooling fins rather than circulating air internally. This eliminates the reliability issues of internal fans while maintaining effective heat removal from the enclosure.
Solution Approach 2:
The invention introduces cooling fins as an intermediary structure between the heat-generating components and the external air. The fins conduct heat from the internal components through the enclosure walls to the external environment, serving as a thermal bridge that enables heat removal without requiring internal fans or compromising the sealed enclosure.
2Temperature
If apertures are provided in the enclosure for air circulation, then cool external air can enter and hot air can be exhausted, but security is compromised as holes in the logic box are undesirable or not permitted
Solution Approach 1:
The invention extracts the air intake and exhaust functions from the internal enclosure and relocates them to the external environment. Cooling fins and an external fan are positioned outside the sealed logic box, allowing air to be drawn from and exhausted to the external environment without creating any apertures in the enclosure walls.
Solution Approach 2:
The invention introduces cooling fins as an intermediary thermal conduction path that bridges the sealed enclosure and the external environment. Heat is conducted through the fin structures attached to the enclosure exterior, enabling thermal exchange without requiring physical openings in the security-critical enclosure.
3Temperature
If small diameter fans are mounted directly on devices in PC systems, then heat can be removed from components, but fans are generally low reliability items especially small diameter fans
Solution Approach 1:
The invention extracts the fan from the component-level cooling arrangement and relocates it to an external enclosure-level cooling system. Instead of mounting small fans directly on heat-generating components, the fan is positioned outside the enclosure and cooled air is drawn through external fins, eliminating the need for small internal fans entirely.
Solution Approach 2:
The invention introduces external cooling fins as an intermediary structure that provides a large surface area for heat dissipation without requiring direct fan-to-component coupling. The fins conduct heat from the enclosure walls to the external air, allowing effective cooling with a single large, reliable external fan rather than multiple small internal fans.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively removes heat from high-power components without increasing internal temperatures, enhancing system reliability and security by maintaining a sealed enclosure while ensuring efficient cooling, thus addressing the challenges of heat dissipation and security in slot machines.
Implementation Method 1
at least said wall being thermally conductive
Implementation Method 2
cooling fins on their surfaces outside of the chamber
Implementation Method 3
a large, reliable fan for external air flow through cooling fins
Data Source
AI summary
A secure control unit is provided with a completely sealed casing (22) of which at least one wall (24) forms a heat sink. The circuit board provided in the casing (22) is designed such that all of the heat generating components (16-20) which require cooling are located on the lower side of the circuit board (10) and in thermal connection with the heat sink wall (24). Components which do not generate excessive heat are located on the upper side of the circuit board (10). Raised conductive blocks (32-36) couple thermally the components (16-20) to the wall (24). With this arrangement it is not necessary to provide cooling internally of the casing (22) and it is possible nevertheless to use high powered components of the type which are found in modern computers. The casing remains secure and thus suitable for high security applications.