Sealed Chip Package With Segmented Extraction Chambers

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Solution Overview

Problem

There is a need for packaging systems and methods that allow for high-throughput analysis of chemical species while maintaining environmental protection and enabling quick and reliable access to analysis chips for automated robotic systems, particularly in applications like DNA sequencing where contamination and handling damage are concerns.

Innovation Solution

An environmentally sealed strip with multiple chambers, each containing a chip carrier that holds an analysis chip, sealed with a sealing film, allowing for the chip to be easily extracted using a piercing and extraction tool for further processing and analysis, while maintaining protection during shipping and handling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the analysis chip is sealed in an environmentally protected package for shipping and handling, then contamination and damage are prevented, but quick and reliable access for automated robotic systems becomes difficult

Engineering Contradiction:
Improveprotection from contaminationVSAvoidaccess for automated systems
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The sealed package is divided into multiple individual chambers, each containing a separate analysis chip. This segmentation allows automated robotic systems to access and retrieve individual chips without compromising the sealed environment of other chips, thus maintaining both protection and ease of operation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A break-away feature acts as an intermediary mechanism between the sealed package and the automated extraction tool. The break-away feature can be reliably triggered by automated systems to open individual chambers, enabling quick access while maintaining the integrity of the sealed environment during shipping and handling.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If multiple analysis chips are packaged together for high throughput analysis, then productivity increases, but individual access and handling become more complex

Engineering Contradiction:
Improvehigh throughput analysisVSAvoidpackaging structure
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

Multiple analysis chips are packaged in separate, independently accessible chambers within a single sealed package. This segmentation allows automated systems to retrieve chips in sequence without handling complexity, maintaining high throughput while simplifying individual access compared to alternative multi-chip packaging approaches.

Inventive Principle:
Principle #1Segmentation

3Stability of the object's composition

If the chip carrier is securely held in place within the chamber, then stability during shipping is improved, but extraction requires more force or complexity

Engineering Contradiction:
Improvechip carrier positionVSAvoidextraction process
Core Design Contradiction:
Stability of the object's compositionVSEase of operation

Solution Approach 1:

The chip carrier is pre-configured with a break-away feature that requires only minimal force to activate. This preliminary design allows the carrier to be securely held during shipping while enabling easy extraction when needed, as the break-away feature has already been engineered to fail at a specific weak point.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The mechanical properties of the chip carrier are designed with a specific parameter change - a break-away feature with controlled strength. This allows the carrier to maintain stability under normal handling conditions while requiring only slight additional force for extraction, balancing both stability and ease of operation.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS8772016B2Sealed chip package
Publication Date: 2014.07.08 PACIFIC BIOSCIENCES OF CALIFORNIA INC
  • US8772016B2 patent drawing
  • US8772016B2 patent drawing
  • US8772016B2 patent drawing

AI summary

The invention provides environmental packages, instruments, and methods for sealing, protecting, and providing analysis chips for processing and analysis. The analysis chips are bonded directly or indirectly to chip carriers which are held within the chambers of an environmental packaging strip. The chambers are sealed with a sealing film such that the chip carriers can be extracted using a piercing tool and an extraction tool.