Sealed Chip Package Socket Structure for Corrosion-Resistant Contacts
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Increasing pin counts and reduced contact normal force in socket based interconnects lead to susceptibility to electrical failures due to corrosion and oxidation, especially in environments with moisture and contamination, and immersion cooling affects signal integrity and contact resistance.
Innovation Solution
Implementing environmentally sealed regions around socket structures using rings, bellows, or package carriers to prevent the ingress of gases, moisture, and contaminants, thereby protecting contact interfaces from corrosion and oxidation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the number of pins is increased to meet bandwidth and IO speed requirements, then the data transmission capability is improved, but the contact normal force for each contact must be reduced which makes contacts more susceptible to electrical failure
Solution Approach 1:
The patent applies inert atmosphere by providing an environmentally sealed region filled with inert gas (nitrogen or dry air) around the socket structure. This seal prevents moisture and contaminants from reaching the contact interfaces, creating an inert environment that protects against corrosion and oxidation. The sealing mechanism includes a seal ring between the heat spreader and board, and optionally a package carrier surrounding the socket structure, maintaining the inert atmosphere throughout the operational life of the device.
2Speed
If compression mounted technology is used to improve IO speed, then the data transmission capability is improved, but the number of contact interfaces is doubled which increases the chance of electrical failure
Solution Approach 1:
The patent applies inert atmosphere by providing an environmentally sealed region filled with inert gas (nitrogen or dry air) around the socket structure. This seal prevents moisture and contaminants from reaching the contact interfaces, creating an inert environment that protects against corrosion and oxidation. The sealing mechanism includes a seal ring between the heat spreader and board, and optionally a package carrier surrounding the socket structure, maintaining the inert atmosphere throughout the operational life of the device.
3Ease of operation
If contact normal force is reduced to make socketing mechanically feasible, then the mechanical feasibility is improved, but the contacts become more susceptible to corrosion and oxidation
Solution Approach 1:
The patent applies inert atmosphere by providing an environmentally sealed region filled with inert gas (nitrogen or dry air) around the socket structure. This seal prevents moisture and contaminants from reaching the contact interfaces, creating an inert environment that protects against corrosion and oxidation. The sealing mechanism includes a seal ring between the heat spreader and board, and optionally a package carrier surrounding the socket structure, maintaining the inert atmosphere throughout the operational life of the device.
4Temperature
If immersion cooling is used to cool the system, then the thermal management is improved, but the signal integrity and contact resistance are affected
Solution Approach 1:
The patent applies inert atmosphere by providing an environmentally sealed region filled with inert gas (nitrogen or dry air) around the socket structure. This seal prevents moisture and contaminants from reaching the contact interfaces, creating an inert environment that protects against corrosion and oxidation. The sealing mechanism includes a seal ring between the heat spreader and board, and optionally a package carrier surrounding the socket structure, maintaining the inert atmosphere throughout the operational life of the device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the reliability and performance of electronic systems by reducing the probability of defects at contact interfaces and maintaining signal integrity.
Implementation Method 1
Implementing environmentally sealed regions around socket structures using rings, bellows, or package carriers to prevent the ingress of gases, moisture, and contaminants
Data Source
AI summary
Embodiments disclosed herein include socketing apparatuses with environmental sealing options. In an embodiment, such an apparatus comprises a first substrate, and a second substrate over the first substrate. In an embodiment, a socket structure is provided between the first substrate and the second substrate, where the socket structure comprises a plurality of electrical interconnects between the first substrate and the second substrate. In an embodiment, a die is over the second substrate, and a third substrate is over the die. In an embodiment, a ring is around the socket structure, and the ring is coupled to the first substrate and the third substrate.