Sealed Ruggedized Computer Thermal Management
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Solution Overview
Problem
Ruggedized computers face challenges in withstanding extreme temperatures and contamination while maintaining performance, as conventional cooling methods using fans introduce damaging contaminants and fail to effectively dissipate thermal energy without air exchange.
Innovation Solution
A computer design featuring a sealed interior cavity with a cooling element and heat sinks that transfer thermal energy externally, using thermally coupled blocks and pipes with thermal compounds, and integral heat sinks to dissipate heat without fans, while incorporating solid-state components and conductive materials for shock and electromagnetic interference protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling fans are used to exchange air between the interior cavity and exterior environment, then thermal energy dissipation is improved, but contamination from water, dust, debris, and moisture increases
Solution Approach 1:
The patent removes the cooling fan from the system entirely, extracting the harmful moving mechanical component that created the contradiction. Instead, it uses passive heat sinks with extended surfaces that dissipate heat through conduction and convection without requiring air exchange, thereby eliminating contamination influx while maintaining thermal management capability
Solution Approach 2:
The patent replaces the mechanical cooling fan system with a passive thermal management system using heat sinks, thermal conduction paths, and natural convection. This substitution eliminates moving parts and mechanical air forcing, allowing heat dissipation through thermal conduction to heat sink structures and natural air convection around external surfaces, thereby preventing contaminant entry while managing thermal energy
2Productivity
If the rate or volume of air exchange is increased to dissipate thermal energy at higher temperatures, then cooling efficiency is improved, but the influx of damaging contaminants increases
Solution Approach 1:
The patent extracts the forced air exchange mechanism (cooling fan) from the system and replaces it with passive thermal management structures that achieve cooling efficiency through enhanced thermal conduction paths and extended heat sink surfaces, eliminating the need for high-volume air exchange and thereby preventing contaminant influx
Solution Approach 2:
The patent shifts the heat dissipation approach from a volume-based air exchange system to a surface-based thermal management system. By using heat sinks with extended surfaces and thermal conduction paths that contact housing walls, the system dissipates heat through increased surface area exposure to external environment, achieving cooling efficiency without requiring high-volume air exchange through sealed openings
3Object-affected harmful factors
If a sealed interior cavity is used to prevent contamination, then protection from contaminants is improved, but thermal energy dissipation becomes more difficult
Solution Approach 1:
The patent introduces heat sinks as intermediary thermal management components that extend from the interior cavity through the housing walls to the exterior environment. These heat sinks serve as thermal conduits that conduct heat from internal components through the sealed housing structure to external surfaces, enabling thermal energy dissipation while maintaining the sealed cavity's contaminant protection
Solution Approach 2:
The patent integrates the housing walls to serve dual functions: maintaining structural密封ity for contaminant protection and acting as thermal conduction paths for heat dissipation. The heat sinks are designed to contact and thermally couple with the housing walls, allowing the housing structure to simultaneously provide environmental sealing and thermal management pathways
4Temperature
If conventional cooling methods are used, then thermal energy dissipation is achieved, but reliability decreases due to fan failure and contamination
Solution Approach 1:
The patent removes the cooling fan (a mechanical component subject to failure) from the system and replaces it with passive thermal management components (heat sinks and thermal conduction paths) that have no moving parts. This extraction of mechanical components eliminates failure modes associated with fan bearings, motors, and seals, thereby significantly improving reliability and mean time between failures while maintaining thermal energy dissipation capability
Solution Approach 2:
The patent implements a self-service thermal management system where heat sinks and thermal conduction paths passively dissipate heat without requiring external power or control. The system automatically manages thermal energy through natural thermal conduction and convection processes, eliminating the need for active fan control and reducing points of failure, thereby improving reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable operation in high-temperature environments up to 65°C and varying humidity levels, preventing contamination and enhancing mean time between failures with reduced power consumption and improved shock resistance.
Implementation Method 1
A cooling element is thermally coupled to the heat sink and at least one of the computer components to transfer thermal energy from the computer component into the heat sink and the exterior environment
Implementation Method 2
the transfer of thermal energy within the pipe occurs at least in part by convection
Implementation Method 3
at least one heat sink for dissipating thermal energy into the exterior environment
Data Source
AI summary
Illustrative embodiments of the present invention are directed to a computer that has a housing with walls that form a substantially sealed interior cavity from an exterior environment. The computer includes a plurality of computer components within the interior cavity. The computer also includes at least one heat sink for dissipating thermal energy into the exterior environment. A cooling element is thermally coupled to the heat sink and at least one of the computer components to transfer thermal energy from the computer component into the heat sink and the exterior environment.