Sealed Cooling Array With Curved Fins For Rugged Enclosures
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Solution Overview
Problem
Electronic devices in harsh environments, such as those exposed to extreme temperatures, moisture, dust, and vibration, face cooling challenges due to the need to maintain the integrity of ruggedized housings, which limits the effectiveness of conventional cooling systems.
Innovation Solution
A submersible, forced-convection cooling apparatus featuring a base plate with strategically positioned motors and fans, along with curved fins forming a yin-yang pattern, that draws a cooling medium from the center to the periphery, providing efficient convective cooling without compromising the housing's integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cooling systems are used in ruggedized housings, then electronic devices can be protected from harsh environments, but heat dissipation effectiveness deteriorates due to the sealed housing structure
Solution Approach 1:
The patent introduces a sealed cooling assembly as an intermediary system between the electronic device and the external environment. This assembly includes sealed motors, fans, and heat exchange components that can actively cool the device without compromising the sealed housing structure. The cooling medium (air or liquid) circulates within this sealed intermediary system, allowing effective heat dissipation while maintaining the protective seal against harsh environments.
Solution Approach 2:
The cooling system is segmented into distinct functional components: sealed motors, fans for air movement, heat exchange surfaces (fins), and sealed couplings. This segmentation allows each component to be optimized for its specific function while collectively solving the heat dissipation problem within the constraints of the sealed housing.
2Reliability
If the housing is made more sealed to protect against moisture and dust, then environmental protection improves, but heat removal capability worsens
Solution Approach 1:
The sealed cooling assembly acts as an intermediary that reconciles the conflict between sealing and heat removal. It provides a controlled internal environment where heat can be actively removed through fans and heat exchange surfaces, while the sealed structure maintains protection against moisture and dust ingress.
Solution Approach 2:
The patent utilizes pneumatic principles through fans that force air circulation within the sealed housing. The forced convection current moves heat away from electronic components and transfers it to heat exchange surfaces, enabling effective heat removal capability while the housing remains sealed against environmental contaminants.
3Volume of moving object
If compact design is pursued to reduce device size, then device dimensions decrease, but cooling efficiency deteriorates due to limited space for heat dissipation structures
Solution Approach 1:
The patent employs three-dimensional fin structures that extend vertically and radially from the heat source, maximizing heat exchange surface area within the limited horizontal space of the compact housing. This dimensional approach allows efficient heat dissipation without increasing the overall device footprint.
Solution Approach 2:
The heat exchange surfaces utilize curved and radial fin geometries that optimize heat transfer in three-dimensional space. The curved surfaces increase the effective heat exchange area while fitting within the compact cylindrical or rounded housing geometry, maintaining cooling efficiency despite limited volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat dissipation in compact, high-performance electronic devices within ruggedized enclosures, enhancing their operational efficiency and lifespan by integrating both conductive and convective cooling methods while maintaining environmental protection.
Implementation Method 1
A submersible, forced-convection cooling apparatus featuring a base plate with strategically positioned motors and fans... providing efficient convective cooling
Implementation Method 2
The first set of fins protrudes from the base plate... The second set of fins protrudes from the base plate... integrated both conductive and convective cooling methods
Data Source
AI summary
A cooling apparatus for an enclosure. A base plate is mounted to the enclosure, with a first and second motor disposed on a first side of the base plate. First and second fans are disposed in a central location on an opposing side of the base plate, and are rotationally coupled to the motors. First and second sets of fins protrude from the base plate, with proximate ends of the fins disposed proximate the first and second fans, and distal ends of the fins disposed proximate a peripheral edge of the base plate. The fins are curved so as to form first and second partial swirl patterns. The fins are disposed in a spaced configuration, where spacing between the fins is greater at the distal ends than it is at the proximate ends. The first set of fins and the second set of fins are disposed adjacent one another in a yin-yang pattern.