Sealed ECU Housing Cooling With a Single Non-Branching Air Path
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Solution Overview
Problem
Existing electronic control devices face challenges in cooling design due to uneven air volume distribution in multiple flow paths and the need to cool both upper and lower surfaces of a housing, which complicates the cooling process.
Innovation Solution
A circuit board housed within a sealed housing with heat dissipation fins on both surfaces, an air duct forming a single cooling air flow path, and a cooling fan positioned downstream to exhaust air effectively, eliminating branching paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple flow paths are used to cool both upper and lower surfaces of the housing, then the cooling coverage is improved, but the air volume distribution becomes uneven and design complexity increases
Solution Approach 1:
The cooling system is segmented into two independent single-flow-path configurations: one for the lower surface (via base-side heat dissipation fins) and one for the upper surface (via cover-side heat dissipation fins). Each surface has its own dedicated cooling path without branching, simplifying the design while maintaining comprehensive cooling coverage.
Solution Approach 2:
The patent combines the cooling of both upper and lower surfaces into a unified single-flow-path system by strategically positioning heat dissipation fins on both the base and cover. The cooling fan generates a single airflow that sequentially passes through both sets of fins, merging the cooling function for both surfaces into one integrated flow path.
2Temperature
If cooling air is directly blown to electronic components, then cooling efficiency is improved, but dust deposition and short-circuiting risks increase
Solution Approach 1:
The patent introduces heat dissipation fins as an intermediary medium between the cooling air and the electronic components. The fins are positioned between the airflow path and the circuit board, allowing heat transfer from the components to the fins while preventing direct contact between cooling air and electronic components, thus avoiding dust deposition and short-circuiting.
Solution Approach 2:
The patent extracts the electronic components from the direct cooling airflow path by enclosing them within the sealed housing. The cooling air flows through heat dissipation fins on the housing surfaces rather than directly over the components, separating the components from the potentially contaminating airflow.
3Device complexity
If a single cooling fan serves multiple flow paths, then device simplicity is improved, but air volume distribution control becomes difficult
Solution Approach 1:
The patent segments the cooling system into two independent single-flow-path channels, each handling a specific surface (upper or lower). This segmentation allows a single cooling fan to effectively serve both surfaces without complex air volume distribution issues, as each path has dedicated heat dissipation fins and a defined airflow route.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates simplified cooling design by ensuring uniform air distribution and efficient heat dissipation from both surfaces of the housing, enhancing cooling performance.
Implementation Method 1
developments have been conducted for electronic control devices equipped with cooling fans for forced air cooling
Implementation Method 2
a first heat dissipation fin comprising a plurality of protrusions provided on a lower surface of the housing; a second heat dissipation fin comprising a plurality of protrusions provided on an upper surface of the housing
Implementation Method 3
air duct attached to an outer side of the housing so as to cover the first heat dissipation fin and the second heat dissipation fin and adapted to form a cooling air flow path for flowing cooling air therethrough
Data Source
AI summary
An electronic control device (1) includes: a housing (2) adapted to seal and house a circuit board (6); first heat dissipation fins (21a) provided on the lower surface of the housing (2); second heat dissipation fins (22a) provided on the upper surface of the housing (2); an air duct (4) attached to the outer side of the housing (2) so as to cover the first heat dissipation fins and the second heat dissipation fins and adapted to form a cooling air flow path for flowing cooling air therethrough near the upper surface and the lower surface of the housing (2); and cooling fans (8) installed downstream of the heat dissipation fins (21a, 22a) positioned in a downstream side of the cooling air flow path, out of the first heat dissipation fins (21a) and the second heat dissipation fins (22a), and adapted to exhaust cooling air toward the downstream side of the cooling air flow path. The cooling air flow path is formed to be a single flow path without branching, through a portion from the first heat dissipation fins (21a) up to the second heat dissipation fins (22a).