Sealed Electronic Components for Reusable Surgical Devices

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Solution Overview

Problem

Reusable surgical devices with electronic components are vulnerable to damage from high pH cleaning and sterilization processes, leading to corrosion and degradation.

Innovation Solution

The electronic components are sealed using a seal assembly that includes an encapsulate and a housing, which protects them from harsh environments by minimizing fluid ingress during cleaning and sterilization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If electronic components are used in reusable surgical devices to enhance control functions, then device intelligence and functionality are improved, but vulnerability to damage from cleaning and sterilization processes increases

Engineering Contradiction:

Improvedevice intelligenceVSAvoidcomponent durability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The device is divided into separate sterile and non-sterile portions, with electronic components isolated in a protected housing that can be sterilized independently from the disposable surgical instrument, allowing the electronic components to withstand sterilization processes while the rest of the device remains disposable

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A sealed housing acts as an intermediary barrier between the electronic components and the harsh sterilization environment, protecting the components from moisture and chemical exposure while allowing the housing itself to be sterilized

Inventive Principle:

Principle #24Intermediary (Mediator)

2Duration of action of moving object

If electronic components are exposed to high pH cleaning and sterilization solutions, then device reusability is enabled, but component corrosion and degradation worsen

Engineering Contradiction:

Improvedevice cycle lifeVSAvoidchemical exposure

Core Design Contradiction:

Duration of action of moving objectVSObject-affected harmful factors

Solution Approach 1:

The sealed housing serves as a protective intermediary that shields electronic components from direct contact with high pH cleaning solutions and sterilization chemicals, allowing the housing to be exposed to these harsh conditions while the components remain protected

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The housing creates a chemically inert sealed environment around the electronic components, isolating them from reactive chemical exposures during cleaning and sterilization processes

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

3Duration of action of stationary object

If electronic components undergo repeated autoclaving, then device reusability is achieved, but moisture ingress and component degradation increase

Engineering Contradiction:

Improvecomponent service lifeVSAvoidcomponent functionality

Core Design Contradiction:

Duration of action of stationary objectVSReliability

Solution Approach 1:

The sealed housing acts as a mediator that allows the electronic components to undergo repeated autoclaving cycles while protecting them from moisture ingress, enabling long-term reuse without functional degradation

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS20250352213A1Surgical devices including sealed electronic components

Publication Date: 2025.11.20 COVIDIEN LP

AI summary

An electronic assembly includes a first electronic component, a second electronic component, and a seal assembly. The first electronic component includes a substrate and a first electrical connecting portion secured to the substrate, and the second electronic component includes a second electrical connecting portion connected to the first electrical connecting portion forming an electronic connection between the first and second electronic components. The seal assembly includes a housing and an encapsulate. The housing defines a cavity and has one or more open sides. The housing is positioned over the electronic connection and is mated to the substrate resulting in a single open side. The encapsulate is disposed within the cavity of the housing and covers the electronic connection. The encapsulate seals closed the single open side of the housing.