Sealed Electronics Housing for Stable Ambient Conditions
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Solution Overview
Problem
Electronics components used in aircraft are often unreliable due to environmental conditions such as reduced pressure and humidity, leading to increased development and certification costs, and certain components like plastic packaged devices cannot be used reliably as they are not designed for these conditions.
Innovation Solution
An aircraft electronics assembly with a sealed housing that maintains constant ambient conditions, using sensors to monitor and control temperature, humidity, and pressure, allowing for the use of less expensive, ground-based electronics components by creating a controlled environment within the housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sealed housing with environmental control is used, then reliability of electronics components is improved, but device complexity increases
Solution Approach 1:
The housing assembly is divided into functional segments: the sealed housing structure, the electronics unit, the sensor system, and the control system. This segmentation allows each component to be optimized independently while maintaining overall reliability through modular architecture.
Solution Approach 2:
The sealed housing acts as an intermediary barrier between the electronics components and the harsh external environment. It mediates the environmental stresses by providing a controlled internal atmosphere, thereby protecting the components without requiring the components themselves to be environmentally hardened.
2Measurement precision
If sealed housing with sensors and control systems is implemented, then monitoring capability is improved, but manufacturing cost increases
Solution Approach 1:
The sensor system is designed to monitor multiple ambient parameters (temperature, humidity, pressure) simultaneously using a integrated sensor array. This multi-functionality reduces the need for separate monitoring systems for each parameter, thereby controlling manufacturing costs while improving comprehensive monitoring capability.
Solution Approach 2:
The electronics assembly performs self-monitoring and self-diagnosis through the integrated sensors that continuously track ambient conditions. The system automatically detects deviations from acceptable ranges and can trigger alerts or protective actions, reducing the need for external monitoring infrastructure and lowering overall system cost.
3Ease of manufacture
If standard ground-based electronics components are used, then cost is reduced, but adaptability to airborne environment is worsened
Solution Approach 1:
The sealed housing creates a controlled environment where ambient parameters (temperature, humidity, pressure) are maintained within ranges suitable for standard ground-based electronics. By changing and stabilizing these environmental parameters, the system enables the use of cost-effective commercial off-the-shelf components in the airborne environment.
Solution Approach 2:
The housing assembly creates an inert or controlled atmosphere inside the sealed enclosure, protecting standard electronics components from the harsh airborne environment. This inert environment allows components not designed for airborne use to operate reliably, thereby reducing costs while maintaining adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the reliable use of non-certifiable electronics components in aircraft by maintaining stable internal conditions, reducing costs and simplifying design, while providing real-time monitoring for potential leaks or failures, ensuring safety and maintenance alerts.
Implementation Method 1
a housing for sealingly receiving therein the electronics unit and for maintaining substantially constant ambient conditions therein
Implementation Method 2
an ambient parameter data sensor for sensing an ambient parameter indicative of the ambient conditions
Implementation Method 3
the plastic package may leak allowing harmful water vapour or oxygen or other gases to contaminate the silicon die or internal connections
Data Source
AI summary
An aircraft electronics housing assembly maintains the electronics unit at given ambient conditions despite changes in conditions outside the housing during the aircraft flight cycle.