Sealed Enclosure Cooling via Liquid Heat Exchange
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Solution Overview
Problem
RF generators and matching networks in semiconductor manufacturing systems generate heat, leading to thermal damage and outgassing, which can contaminate the environment and cause financial losses due to inefficient cooling methods.
Innovation Solution
A sealed enclosure system with a heat sink containing a heat exchanger and a fan that directs heated air onto the heat exchanger, transferring heat to liquid flowing through a tube, effectively cooling the system while preventing air and exhaust from escaping, thus minimizing contamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling is used with fans to cool electrical components, then cooling capability is provided, but thermal damage and outgassing occur due to insufficient cooling efficiency
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by introducing a coolant circulation system with pumps and heat exchangers. The liquid coolant flows through channels in or near electrical components, absorbing heat more efficiently than air, thereby preventing thermal damage and outgassing while maintaining system reliability.
Solution Approach 2:
The patent introduces a liquid coolant as an intermediary medium between the electrical components and the environment. The coolant absorbs heat from components through thermal conduction and transports it to external heat exchangers, where heat is dissipated to the surroundings, thus protecting components from thermal damage.
2Temperature
If air inlet and exhaust holes are provided in the enclosure for air cooling, then cooling is achieved, but outgassed gases and materials contaminate the surrounding environment
Solution Approach 1:
The patent replaces the air-based cooling system with a liquid-based cooling system, eliminating the need for air inlet and exhaust holes in the enclosure. The sealed enclosure prevents outgassed materials from escaping into the environment, while liquid coolant channels remove heat internally without requiring atmospheric exchange.
Solution Approach 2:
The patent creates a sealed, inert environment within the enclosure by eliminating openings to the atmosphere. The liquid cooling system operates in isolation from the external environment, preventing contamination of surrounding areas with outgassed materials while maintaining effective heat removal.
3Temperature
If water-cooled heat sinks are used for high power RF generators, then cooling efficiency is improved, but device complexity increases due to additional cooling infrastructure
Solution Approach 1:
The patent designs a modular liquid cooling system where the coolant circulation infrastructure serves multiple electrical components simultaneously. The same pumps, coolant channels, and heat exchangers cool various RF components, power amplifiers, and other heat-generating elements, reducing overall system complexity compared to individual cooling solutions for each component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system efficiently cools electrical components, preventing thermal damage and outgassing, maintaining a clean environment and reducing financial losses by effectively removing heat from the enclosure.
Implementation Method 1
the heat exchanger is configured to receive heat from air pushed by the fan, and transfer the received heat to the liquid being transported by the tube through the heat exchanger
Implementation Method 2
a fan enclosed by the enclosure, the fan configured to push air heated by electrical components onto the heat exchanger
Data Source
AI summary
In one embodiment, the invention can be a system for cooling an enclosure enclosing electrical components and configured to prevent air and exhaust from escaping the enclosure. The system can include a heat sink comprising a heat exchanger, and a tube extending into and out of the heat exchanger, the tube configured to transport liquid through the heat exchanger. The system can further include a fan configured to push air heated by electrical components onto the heat exchanger. The heat exchanger can be configured to receive heat from air pushed by the fan, and transfer the received heat to the liquid being transported by the tube through the heat exchanger.