Sealed Fluid Cooled Electronic Assembly
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Solution Overview
Problem
Conventional electronic assemblies for high-power applications, such as those in electric and hybrid-electric vehicles, face challenges in effectively dissipating thermal energy, leading to reduced performance and potential electrical circuit failure due to excessive heat buildup, necessitating enhanced cooling solutions.
Innovation Solution
The electronic assembly incorporates a sealed fluid compartment with inlet and outlet ports and fluid flow channels formed on the electronic device, allowing cooling fluid to flow through the device for efficient heat transfer, utilizing a housing with conductive leads and channels in the semiconductor material to enhance thermal energy dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional exposed metal thermally conductive structures are used to conduct thermal energy to external heat sink, then thermal cooling is achieved, but the cooling effectiveness is insufficient for high-power electronic devices
Solution Approach 1:
The patent applies fluid cooling (hydraulics) by incorporating cooling channels within the semiconductor package structure that allow coolant to flow directly through the device. This replaces conventional solid metal heat sink structures with a fluid-based thermal management system, enabling significantly higher heat dissipation capacity for high-power electronic devices while maintaining structural integrity and reliability
2Temperature
If enhanced fluid cooling is implemented for high-power electronic devices, then thermal cooling effectiveness is improved, but device complexity and cost increase
Solution Approach 1:
The patent merges the cooling function with the existing semiconductor package structure by integrating cooling channels directly into the device fabrication process. This consolidation eliminates separate cooling components and assemblies, reducing overall system complexity while achieving enhanced heat dissipation capacity through the unified package design
Solution Approach 2:
The semiconductor package structure serves multiple functions simultaneously: electrical circuit functionality, mechanical support, and thermal management through integrated cooling channels. This multi-functionality eliminates the need for separate dedicated cooling components, reducing system complexity and cost while maintaining enhanced cooling effectiveness
3Ease of manufacture
If conventional solid structure thermal conduction is used, then manufacturing is simpler, but heat dissipation capability is limited for high-power applications
Solution Approach 1:
The patent changes the thermal management approach from solid-phase thermal conduction to fluid-phase heat transfer by incorporating cooling channels. This parameter change enables significantly higher heat dissipation capacity for high-power applications while maintaining manufacturing simplicity through integration into the semiconductor fabrication process rather than requiring complex post-assembly operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves enhanced thermal cooling, reducing the size and cost of electronic assemblies, increasing power output, and improving overall performance by effectively transferring heat away from high-power electronic devices.
Implementation Method 1
fluid flow channels formed in thermal communication with the electronic device within the housing
Implementation Method 2
fluid to flow from the inlet port into fluid communication with the electronic device to cool the electronic device
Data Source
AI summary
An electronic assembly is provided having a thermal cooling fluid, such as a liquid, for cooling an electronic device within a sealed compartment. The assembly includes a housing generally defining a sealed fluid compartment, an electronic device disposed within the housing and a cooling liquid for cooling the electronic device. The assembly includes inlet and outlet ports in fluid communication with the sealed fluid compartment for allowing the cooling liquid to pass through the compartment to cool the electronic device. Fluid flow channels are formed in thermal communication with the electronic device within the housing. The fluid channels include channels that allow liquid to flow in thermal communication with the electronic device to cool the device.