Sealed Housing Packaging with Thermal Conduction for Signal Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Airtight packaging structures for electronic devices are difficult to maintain and adjust, leading to reduced device reliability due to poor thermal conductivity and deformation issues, which affect the performance and air tightness of the packaging.
Innovation Solution
A housing packaging structure with a thermally conductive portion and electrical connector, where the thermal conductivity coefficient of the thermally conductive portion is higher than the packaging housing, allowing efficient heat transfer and reducing deformation impact, while using materials like glass for the packaging housing to maintain air tightness and selectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a packaging housing with poor thermal conductive performance is used, then material selectivity and cost are improved (e.g., glass), but thermal conductive performance deteriorates, causing heat accumulation that impacts signal transmission device performance
Solution Approach 1:
The patent employs a composite structure where the packaging housing is made of glass (poor thermal conductor) and is integrated with a thermally conductive portion made of metal or other high thermal conductivity materials. This composite approach allows the housing to maintain its advantages (cost, selectivity, deformation resistance) while the thermally conductive portion provides the necessary heat dissipation pathway, resolving the contradiction between material selectivity and thermal conductive performance.
2Stability of the object's composition
If the packaging housing structure deforms in high temperature environment, then structural integrity is compromised, but using deformation-resistant materials improves structural stability, potentially impacting other performance aspects
Solution Approach 1:
The patent applies local quality by making different portions of the housing structure from different materials with different properties. The packaging housing uses glass for overall structural stability and deformation resistance, while the thermally conductive portion uses materials optimized for thermal management. This localized material differentiation allows each portion to perform its specific function optimally without compromising overall reliability.
3Reliability
If heat accumulates in the sealed cavity, then signal transmission device performance is impacted, but improving thermal conductivity may affect the sealed cavity's air tightness
Solution Approach 1:
The patent segments the housing structure into distinct functional portions: the packaging housing that maintains the sealed cavity and air tightness, and the thermally conductive portion that provides heat dissipation. The thermally conductive portion is integrated into the housing structure but is positioned and designed to conduct heat away from the sealed cavity without compromising the seal integrity, thus resolving the contradiction between heat dissipation and air tightness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the reliability of the signal transmission device by enhancing thermal conductivity, reducing deformation-induced damage, and maintaining air tightness, thus ensuring reliable performance and connection between the signal transmission device and electrical connector.
Implementation Method 1
the thermal conductivity coefficient of the thermally conductive portion is greater than a thermal conductivity coefficient of the packaging housing. Heat in the sealed cavity may be preferentially transferred to the outside of the sealed cavity by using the thermally conductive portion
Data Source
AI summary
A housing packaging structure includes a packaging housing, a thermally conductive portion, and an electrical connector. The packaging housing is connected to the thermally conductive portion to form a sealed cavity, where the sealed cavity is configured to accommodate a signal transmission device, a thermal conductivity coefficient of the thermally conductive portion is greater than a thermal conductivity coefficient of the packaging housing, and the electrical connector runs through the packaging housing. A material with poor thermal conductive performance may be selected for the packaging housing, thereby increasing selectivity of a material for the packaging housing.