Sealed IFE Electronics Box With External Cooling Duct
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Solution Overview
Problem
Conventional electronics boxes for in-flight entertainment systems are complex, difficult to maintain and upgrade, prone to dust and moisture intrusion, and limited in installation options due to inefficient cooling and fan designs.
Innovation Solution
A modular design with separate processor and power supply modules, a sealed structure, and an external cooling system that uses a duct cover and heat dissipation elements to prevent dust and moisture intrusion while allowing easy access and efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electronics boxes use integrated design with internal cooling, then cooling function is provided, but the structure becomes complex and difficult to maintain and upgrade
Solution Approach 1:
The electronics box is divided into separate functional modules: a sealed enclosure containing electronic components, and an external cooling structure with fan and heat dissipation elements. This segmentation allows independent maintenance and upgrading of each module without affecting the entire system.
Solution Approach 2:
The cooling structure is extracted from the sealed enclosure and positioned externally. The fan and heat dissipation elements are located outside the sealed environment, connected via thermal conductive structures, allowing the sealed enclosure to be simplified while maintaining effective cooling.
2Temperature
If conventional electronics boxes use open structure for cooling access, then heat dissipation is efficient, but dust and moisture can intrude into electronic components
Solution Approach 1:
A sealed enclosure acts as an intermediary barrier between the electronic components and the external environment. Thermal conductive structures serve as intermediaries to transfer heat from the sealed enclosure to the external cooling structure, enabling heat dissipation without compromising the sealed environment.
Solution Approach 2:
The sealed enclosure uses sealed structures with thermal conductive elements that allow thermal energy transfer while maintaining physical separation and protection from contaminants. The sealed design prevents dust and moisture intrusion while the external cooling structure provides heat dissipation pathways.
3Ease of manufacture
If conventional electronics boxes use fixed installation design, then assembly is simple, but installation options are limited
Solution Approach 1:
The modular segmented design with separate sealed enclosure and cooling structure allows flexible arrangement and positioning during installation. Each module can be independently positioned and connected, providing multiple installation configurations while maintaining assembly simplicity through standardized interfaces.
4Reliability
If conventional electronics boxes place fan inside the enclosure, then cooling is direct, but fan design becomes complex and access for maintenance is difficult
Solution Approach 1:
The fan is extracted from the sealed enclosure and positioned in the external cooling structure. This allows the fan to be easily accessed for maintenance, inspection, and replacement without opening the sealed enclosure, while still providing effective cooling through the external heat dissipation pathway.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy maintenance and upgrades, reduces installation space, and enhances installation flexibility by protecting components from contaminants and optimizing cooling, thereby improving passenger experience.
Implementation Method 1
a fan introducing air from outside into the cooling structure, the air creating an air passage that is external to the sealed enclosure
Implementation Method 2
one or more heat dissipation elements disposed in the air passage and configured to dissipate heat generated by the electronic components
Data Source
AI summary
This patent document describes techniques are related to an apparatus for an electronics box for an in-flight entertainment system. The electronics box comprises: a sealed enclosure including electronic components for the in-flight entertainment system disposed in a commercial passenger vehicle; and a cooling structure disposed on a surface of the sealed enclosure and includes: a fan introducing air from outside into the cooling structure, the air creating an air passage that is external to the sealed enclosure and extending along the surface of the sealed enclosure; one or more heat dissipation elements disposed in the air passage and configured to dissipate heat generated by the electronic components; and a duct cover covering the fan and the one or more heat dissipation elements and having an air inlet through which the air enters into the cooling structure.